SMT Stencil Application & Solder Paste Printing
Actionable guides on stencil application and paste printing — squeegee setup, paste-transfer efficiency, print inspection (SPI), and troubleshooting bridging, insufficient solder, slumping, and smearing — for high-yield prototyping and mass manufacturing.
Latest Posts
SMT Stencil Application & Printing
SMD Assembly vs THT Assembly: A Practical Guide
Every PCB design eventually faces the same fork: should this part be SMD or THT, and what does that choice actually mean for the manufacturing line? The distinction between SMD and THT assembly extends far beyond component selection. It requires two completely separate manufacturing toolchains and introduces entirely distinct defect modes. For mixed-technology layouts, a critical intermediate step is the bottom-side adhesive process. This stage involves dispensing precise dots of thermosetting epoxy t......
Jul 30, 2026
SMT Stencil Application & Printing
The Complete Stencil Guide for Lead-Free Solder Paste Printing
Key Takeaways SAC305 is the global standard: Sn96.5/Ag3.0/Cu0.5 offers a near-eutectic melting range of 217–220°C, excellent mechanical reliability, and broad industry acceptance. SN100C (Sn-Cu-Ni+Ge) is the leading silver-free alternative for high-volume cost reduction. 34°C higher melting point shrinks process window: Lead-free alloys melt ~34°C higher than Sn63/Pb37, requiring tight reflow profiles with peak temperatures of 235–250°C and TAL of 45–90 seconds. Paste storage is non-negotiable: Store ......
Jun 15, 2026