JLCPCB Blog

Assembly Techniques

How to Use Solder Paste: Stencil, Syringe, and Iron Methods

Key Takeaways: How to Use Solder Paste Solder paste must be applied before component placement and reflowed with a controlled heat profile. Stencil printing provides the most consistent and reliable results. Manual methods (syringe or iron) are suitable only for low-density or repair work. Solder paste is the foundation of modern electronics assembly. In simple terms, it is a mixture of microscopic solder spheres and flux held together in a creamy consistency. Unlike traditional wire solder, it is app......

Mar 27, 2026

Basics & Tips

What Is Solder Paste? A Complete Guide to Composition, Uses, and PCB Assembly

Solder paste is a thick, gray putty made by mixing microscopic metal solder powder with a sticky flux binder. In electronics manufacturing, it is primarily used in Surface Mount Technology (SMT) to temporarily glue surface-mount components to a printed circuit board (PCB). Once heated in a reflow oven, the paste melts to form permanent, highly reliable electrical and mechanical connections. In this comprehensive guide, we will explore: Solder Paste Composition: The exact blend of solder alloy powder a......

Mar 27, 2026

Basics & Tips

What Is Flux for Soldering? A Complete Guide to Types, Uses, and Applications

Flux for soldering is a chemical cleaning agent that removes oxidation from metal surfaces, improves solder flow (wetting), and prevents further oxidation during heating. It ensures strong, reliable electrical connections in electronics and PCB assembly. Whether you are repairing a broken wire or assembling a printed circuit board (PCB), achieving a flawless solder joint is critical. Soldering flux plays a critical role by cleaning metal surfaces, improving solder flow, and preventing oxidation during......

Mar 27, 2026

Components & Sourcing

What Is a BGA Chip? A Complete Guide to Ball Grid Array Packaging

Modern electronics require compact packages with high connection density and efficient heat dissipation. Ball Grid Array (BGA) technology has become a key solution for high-performance PCB design. Because of these advantages, BGA chips are widely used in processors, graphics devices, memory modules, networking hardware, and compact embedded systems. This guide explains how BGA packages work, the common types available, their key benefits and challenges, and the essential PCB design and assembly consid......

Mar 27, 2026

Design for Manufacturing

Using Via-in-Pad Technology: What You Need to Know, Design Guidelines, and More…

In the world of multi-layer PCB (Printed Circuit Board) design, vias are essential parts that connect different layers of a board. As electronic devices become more compact and complex, designers must employ advanced technologies to optimize board space and performance. One such technology is via-in-pad technology, which has become increasingly popular in high-density and high-performance PCB designs. This article explores the essentials of via-in-pad technology, including guidelines for its implement......

Mar 27, 2026

Design Fundamentals & Schematics

The Importance of Copper Pour in Empty Areas on PCBs

Having too much empty space without copper in a PCB design can have negative effects on manufacturing and the quality of the final product. Placing copper pour means filling unused space on a PCB with planar copper. It is an important part of PCB design and all major PCB design software is able to automatically place copper pour. Copper pour helps build EMC by lowering ground impedance, increasing power efficiency by reducing voltage drops, and mitigating EMI by shrinking loop areas. JLCPCB has five s......

Apr 24, 2023