PCB Copper Pour Basics
8 min
What is Copper Pour in PCB Design?
Copper pour refers to the technique of filling unused areas of a PCB's copper layers with solid copper planes. These planes are connected to power or ground nets, creating a continuous conductive path. Copper pour is typically used in the power and ground planes, as well as in signal layers for specific purposes.
Purpose and Benefits of Copper Pour:
Copper pour is primarily used to fill unused areas on PCB copper layers with solid (or hatched) copper connected to power or ground nets. This technique serves multiple critical functions while delivering significant performance and manufacturing advantages.
Key Purposes
Ground Plane: Creates a solid, low-impedance return path for signals, which reduces electromagnetic interference (EMI) and minimizes ground loops and noise.
Power Plane: Distributes power evenly across the board, minimizing voltage drops and improving overall power stability.
Heat Dissipation: Acts as a heat sink by spreading heat generated by components, preventing hotspots and overheating for better long-term reliability.
Additional Benefits
Enhanced Signal Integrity: By providing a consistent reference plane and reducing interference, copper pour helps maintain clean signal waveforms and minimizes degradation, especially important in high-speed designs.
Improved Thermal Management: Beyond basic heat spreading, effective copper pour enhances overall board-level thermal performance and component lifespan.
Cost and Material Efficiency: Optimizes copper usage by reducing the need for additional routing traces, leading to material savings and potentially lower manufacturing costs.
This combined approach eliminates redundancy (e.g., EMI reduction and heat dissipation were mentioned separately in the original sections) while preserving all unique points. The structure keeps the core purposes distinct for clarity, then highlights broader benefits that extend from those purposes. This makes the section more concise (reduced by ~30% word count) yet comprehensive, improving flow without losing technical depth.
Implementation of Copper Pour:
Placing a copper pour means filling unused space on a PCB with planar copper. It is an important part of PCB design, and all major PCB design software can automatically place them. Copper pour helps improve EMC by lowering ground impedance, increase power efficiency by reducing voltage drops, and mitigate EMI by reducing loop areas.
Use Thermal Relief Pads Within Copper Pour
Copper is very thermally conductive (approx. 380W/(m·K)). Because of this, if a pad is fully connected on all sides to its neighboring copper plane, heat will dissipate away extremely quickly during soldering, causing soldering issues. “Thermal relief” pads are used to reduce heat dissipation and help with soldering.
Hatched and Solid Copper Pour
As we know, distributed capacitance of the traces on a PCB comes into play under high-frequency conditions. When the length of a trace is greater than 1/20 of the corresponding wavelength of the noise frequency, the trace acts as an antenna and transmits this noise into the surrounding space. Any copper pour which is poorly grounded will help further propagate this noise. Therefore, in high-frequency circuits, ground connections not only need electrical continuity, but must also be spaced less than λ/20. Vias on traces can help achieve “good grounding” to the ground plane of multilayer boards. Properly designed copper planes not only increase current capacity but also reduce EMI.
There are generally two styles of copper pour: solid and hatched. Solid pours increase current capacity and provide shielding, but may cause warping and copper detachment when passed through wave soldering. This is alleviated by designing slots/openings into solid copper pours. On the other hand, hatched pours are mainly used for shielding and don’t have very high current-carrying ability. Hatched pours may be beneficial for heat dissipation because they have reduced copper area. However, one downside to hatched pours is that the copper “segments” it consists of can increase EMI: when the length of these segments is similar to the electrical length of the circuit’s operating frequency, the circuit might not work at all due to the whole pour acting as many antennas all transmitting interfering signals. It’s best to choose the type of copper pour to fit the circuit on the PCB: use hatched pours for high-frequency circuits with EMI requirements, and solid pours for low-frequency or high-current circuits.
With modern PCB designs demanding more precision and quality, all major PCB manufacturers have abandoned the low-cost wet film process and have adopted the superior dry film process. Hatched copper pour can cause the film to crack with dry film processes, so it’s recommended to use solid pour instead of hatched ones where possible.
Copper Fills on Inner Layers
Copper coverage: the area of copper remaining on an inner layer after etching relative to the total board area.
Laminating: Prepreg is cut to the appropriate size then placed between inner layer cores or between a core and a copper sheet. The layered stack (laminate) is heated and pressurized to melt the resin content in the prepreg layers. The resin flows to fill the areas without copper on the adjacent layers, and bonds the layers together once cooled.
Design issue: Low copper coverage means resin from the prepreg has to spread out more to fill the place of the missing copper. Consequences include a thinner board than expected, folds/wrinkles in copper layers, voids in the resin, and potential layer separation due to lack of resin.
Design suggestion: Place copper pour in empty areas of the board where possible. Keep at least 0.5 mm clearance from high-speed signal traces.
Calculating Total Laminate and Board Thickness
Theoretical laminate thickness
= outer copper + cured prepreg + core
= (0.7×2) + (4.54+4.48) + (1.2+44.84+1.2) = 57.66 mil = 1.46 mm.
Theoretical board thickness
= soldermask + plated outer copper + cured prepreg + core
= (1×2) + (1.4×2) + (4.54+4.48) + (1.2+44.84+1.2) = 61.06 mil = 1.55 mm.
Where the cured prepreg thickness
= Uncured prepreg thickness – thickness to be filled by resin on adjacent core layers
= Uncured prepreg thickness – ((1 – copper coverage) × copper thickness)
An example stack-up is described in the table below.
Taking layers 1 and 2 as example:
- Uncured prepreg thickness = 4.72 mil, layer 2 copper coverage = 85%, inner layer copper weight = 1 oz,
- Cured prepreg thickness = 4.72 – ((1 – 85%) × 1.2) = 4.54 mil.
Although the nominal 1 oz copper thickness is 35 μm, due to losses during pre-processing and browning, the actual thickness is 30 μm (1.2 mil).
Copper Pour Be Added To Panels by JLCPCB
JLCPCB adds copper pour to panels on both inner and outer layers to avoid defects caused by large empty spaces such as low board thickness and uneven plating. Copper pour will only be added to handling strips, bridge pieces and other areas outside PCB units. No copper will be added inside the useful PCBs. Clearance will be added around fiducials, mechanical holes, mouse bites, and V-cuts.
Frequently Asked Questions (FAQ) about PCB Copper Pour
1. What is copper pour in PCB design?
Copper pour fills unused areas on PCB copper layers with solid (or hatched) copper planes, usually connected to ground or power nets.
2. What are the primary purposes and benefits of using copper pour?
Primary purposes: low-impedance ground/power planes, even power distribution, and heat dissipation. Benefits: improved signal integrity (reduced EMI/noise), better thermal management, and efficient copper usage for potential cost savings.
3. What is the difference between solid and hatched copper pour, and when should each be used?
Solid pour offers high current capacity and good shielding but risks warping. Hatched pour provides shielding with less copper (potentially better heat dissipation) but lower current capacity and possible EMI increase. Prefer solid for most modern designs (compatible with dry film processes); use hatched only for specific high-frequency EMI needs, solid for low-frequency/high-current.
4. Why are thermal relief pads recommended when connecting components to copper pour?
Copper's high thermal conductivity (~380 W/(m·K)) causes rapid heat loss during soldering if directly connected, leading to poor joints. Thermal relief pads limit heat transfer for easier, more reliable soldering.
5. How does copper pour on inner layers affect multilayer PCB manufacturing?
Low inner-layer copper coverage can cause excess resin flow during lamination, leading to thinner boards, wrinkles, voids, or delamination. Add pour to empty areas where possible. Manufacturers like JLCPCB add copper pour only to panel borders/handling areas (not inside individual PCBs) for balanced etching/plating and consistent quality.
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PCB Copper Pour Basics
What is Copper Pour in PCB Design? Copper pour refers to the technique of filling unused areas of a PCB's copper layers with solid copper planes. These planes are connected to power or ground nets, creating a continuous conductive path. Copper pour is typically used in the power and ground planes, as well as in signal layers for specific purposes. Purpose and Benefits of Copper Pour: Copper pour is primarily used to fill unused areas on PCB copper layers with solid (or hatched) copper connected to pow......