FPC Panelization Design Standards and Requirements

FPC (Flexible Printed Circuit Board) panelization is the process of arranging multiple FPC boards onto a single panel for efficient production. Proper panelization is crucial for optimizing material utilization, reducing production costs, and ensuring product quality. JLCPCB recommends following these standards to achieve the best yield and compatibility with SMT processes.

General Panelization Guidelines

Irregularly Shaped Frames: For irregularly shaped FPC frames, consider using JLC's irregular panelization service to maximize material utilization and simplify production.

Stamp Hole and V-CUT Processes: FPC does not support stamp hole and V-CUT processes. Instead, use bridge connection designs for board separation.

FPC Design Requirements

1. Panel Spacing

• Generally, maintain a distance of 2mm between boards.

• For areas reinforced with a steel sheet, increase the spacing to 3mm.

2. Process Edge Design

• Establish a process edge width of 5mm on all sides.
• Cover the process edges with copper, ensuring copper is present throughout the borders except 1 mm clearance around fiducials and 0.5 mm around tooling holes (positioning holes).
• Add four 2mm diameter positioning holes（tooling holes）on the process edge, with one offset by 5mm for error prevention.
• Include four SMT optical points (fiducials) with a 1mm diameter, centered 3.85mm from the panel edge, with one offset by 5mm for error prevention. These fiducials serve as alignment references for SMT placement machines.

3. Bridge Connection Length

• Specify a bridge connection length between 0.7-1.0mm.

• For areas reinforced with a steel sheet, aim for a bridge length of 1mm and increase the number of bridge connections to prevent deformation during SMT.

4. Panel Size:

• Recommended panel size for optimal production: 234 × 490 mm
• Absolute maximum panel size: 250 × 500 mm
• Minimum panel size: 70 × 70 mm

5. SMT Scrap Board Optical Points

• For boards requiring component placement, add scrap board optical points adjacent to each small board.

• If a small board is scrapped during production, the board manufacturer will blacken the corresponding optical point. The placement machine will recognize this and skip component placement, saving costs.

6. Steel Sheet Reinforcement Panelization

• Maintain a spacing of at least 3mm between boards in areas reinforced with a steel sheet (metal stiffeners).

• Cut grooves around the steel sheet area with a width of 0.8mm to facilitate laser forming（required for laser cutting of stiffeners）.

7. Material Utilization

• Consider material utilization in mass production to minimize costs.

• Design widths as 119mm or 250mm.

• Avoid excessively large board sizes for designs with trace/space widths under 3 mil or those fully covered with a steel sheet.

FPC Panelization Example

FPC Panelization example 1:

FPC Panelization Example 2

FPC Panelization Example 3

If self-panelization is challenging, JLCPCB offers a third-party panelization service. Simply provide the single-board GERBER file and let  JLCPCB engineers handle the panelization process.

Small Size Board Panelization Requirements

When the size of a single board is small, production on the line can be problematic, hence panelization is recommended.

1. The minimum size requirement for FPC+SMT boards is 70*70mm; smaller sizes require panelization or the addition of process edges to reach this size

2. For single board sizes less than 50*50mm, panelization production is recommended.

3. For sizes less than 10 × 10 mm, panelization is mandatory, or opt for film delivery (microfilm/tape delivery may be available for ultra-small boards).

Small Size Board Panelization example 1:

Small Size Board Panelization example 2

Small Size Board Panelization example 3

By adhering to these FPC panelization design standards and requirements, engineers can optimize their designs for efficient production, reduced costs, and enhanced product quality.

Conclusion

In conclusion, proper FPC panelization is a critical step that directly impacts production efficiency, material utilization, and final product reliability. By strictly following the design standards outlined in this document—including 2–3 mm board spacing, 5 mm process edges with precise fiducials and tooling holes, 0.7–1.0 mm bridge connections, recommended panel sizes of 234 × 490 mm, and specialized requirements for steel-sheet reinforcement and ultra-small boards—engineers can maximize yield, reduce costs, and ensure seamless compatibility with SMT processes. Whether handling irregular shapes, small-size boards (below 70 × 70 mm), or complex reinforced designs, adhering to these guidelines minimizes manufacturing risks and eliminates the need for unsupported processes such as stamp holes or V-CUT. For designers facing challenges with self-panelization, JLCPCB’s professional third-party panelization service offers a reliable and efficient alternative. Ultimately, optimized panelization not only lowers overall production expenses but also guarantees higher quality and faster time-to-market for flexible printed circuit applications.