SMT Stencil Application & Printing
Discover actionable guides on SMT stencil applications to optimize your solder paste printing process. Learn how to manage paste transfer efficiency, troubleshoot common assembly defects, and execute high-yield production runs for both prototyping and mass manufacturing.
Latest Posts
Stencil Application
The Complete Stencil Guide for Lead-Free Solder Paste Printing
Key Takeaways SAC305 is the global standard: Sn96.5/Ag3.0/Cu0.5 offers a near-eutectic melting range of 217–220°C, excellent mechanical reliability, and broad industry acceptance. SN100C (Sn-Cu-Ni+Ge) is the leading silver-free alternative for high-volume cost reduction. 34°C higher melting point shrinks process window: Lead-free alloys melt ~34°C higher than Sn63/Pb37, requiring tight reflow profiles with peak temperatures of 235–250°C and TAL of 45–90 seconds. Paste storage is non-negotiable: Store ......
Jun 15, 2026
Stencil Application
SMD Assembly vs THT Assembly: A Practical Guide
Every PCB design eventually faces the same fork: should this part be SMD or THT, and what does that choice actually mean for the manufacturing line? The distinction between SMD and THT assembly extends far beyond component selection. It requires two completely separate manufacturing toolchains and introduces entirely distinct defect modes. For mixed-technology layouts, a critical intermediate step is the bottom-side adhesive process. This stage involves dispensing precise dots of thermosetting epoxy t......
Jun 15, 2026