PCB Design Tips: How to Resolve Short Circuit Defects Caused by HASL

PCB Design Tips:

Dense lines, window opening, tin spraying, easy adhesion, it is recommended to make immersion gold.

HASL is also called hot air leveling (HSAL). Its processing method is to immerse the board vertically down into the liquid tin solution through the guide rail, then lift it up, and blow the flat surface with strong hot air. For the exposed copper area with dense lines, Tin liquid is easy to stick adjacent lines, thus forming a short circuit. For this kind of "dense circuit opening" or "coil board", it is recommended to use immersion gold surface technology to avoid such short circuit of HASL.

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