How to Set the Temperature for Wave Soldering and What Are the Soldering Temperature Standards?
4 min
Wave soldering is a process used for soldering electronic components by inserting them into the holes on a Printed Circuit Board (PCB) and securing the components to the board using a molten solder wave generated by a wave soldering machine. Temperature is a crucial parameter during the wave soldering process, as it directly affects the quality and efficiency of soldering. Therefore, setting the temperature correctly for wave soldering is essential.
Temperature for Wave Soldering
Wave soldering machines typically employ radiant heating for preheating, with the most commonly used methods being forced hot air convection, electric hotplate convection, electric heating rods, and infrared heating. Among these methods, forced hot air convection is generally considered the most effective method for heat transfer in most processes. After preheating, the PCB is soldered with either a single wave (λ wave) or dual waves (turbulent wave and λ wave). For through-hole components, a single wave is usually sufficient. When the PCB enters the wave, the direction of solder flow is opposite to the board's movement, creating eddies around component pins. This acts like a washing action, removing residues of flux and oxide films and forming proper wetting as the solder reaches its wetting temperature.
Factors
Setting the temperature for wave soldering involves considering multiple factors, including the solder's melting point, the material of the PCB, and the type of components being soldered. Generally, the temperature for wave soldering should be set near the melting point of the solder and slightly higher to ensure complete melting and good wetting on the soldering surface. However, the temperature should not be too high to avoid damage to the PCB and components.
Usually, the temperature setting for wave soldering needs to be adjusted based on the type of solder used and specific equipment parameters. When adjusting the temperature, it's advisable to gradually increase the temperature while continuously observing the color changes on the soldering surface and recording the temperature variations. In general, the temperature of the soldering surface should fall within the range of 240°C to 260°C, with a maximum temperature not exceeding 280°C.
In addition to temperature, the soldering time is also a critical factor affecting soldering quality. Too short a soldering time can result in incomplete soldering, while excessive time may damage components. Therefore, adjustments should be made according to specific circumstances to achieve the optimal soldering effect.
To sum up, setting the temperature for wave soldering involves considering various factors, including the type of solder, PCB material, and component types. When adjusting the temperature, it's important to gradually increase it while monitoring the color changes on the soldering surface and recording temperature variations to achieve the best soldering results.
Soldering Temperature Standards
Soldering temperature standards refer to the temperature range that should be achieved during the soldering process. For wave soldering, the soldering temperature standard typically falls in the range of 240°C to 260°C. Within this temperature range, the solder, when molten, can flow adequately and wet the soldering surface properly, resulting in stable solder joints.
In addition to the temperature range, soldering temperature standards also need to consider other environmental factors such as humidity and airflow. High humidity and airflow can impact soldering effectiveness. Therefore, adjustments should be made based on the specific production environment to ensure soldering quality and efficiency.
Conclusion
In summary, soldering temperature standards are of paramount importance for the quality and efficiency of wave soldering. Adjustments should be made based on the specific production conditions and environment to ensure soldering quality and efficiency. Regular maintenance and upkeep of wave soldering equipment are also essential to maintain stability and production efficiency. Wave soldering has a history dating back to 1956 when the British company Fry's Metal introduced the concept of printed circuit board wave soldering. It revolutionized the soldering process from manual soldering with soldering irons to automated, large-scale, and highly efficient soldering by machines. Wave soldering offers advantages such as speed, accuracy, and efficiency. It has made significant contributions to reducing soldering defects, improving the reliability of electronic products, lowering production costs, reducing the labor intensity of workers, and increasing production efficiency.
Keep Learning
Reflow Soldering: Everything You Need to Know
Reflow soldering is a crucial process in today's Surface Mount Technology (SMT), enabling the secure mounting of parts ranging from the smallest 0201 passives to complex, high-density Ball Grid Arrays (BGAs). With the ongoing reduction in component sizes, accurate heat management has become a crucial requirement for reliability, which means the process must be error-free. This engineering guide dissects the thermodynamics, fluid dynamics, and metallurgy behind the process. We will cover the four criti......
Selective Soldering: Advanced Process Control for Mixed-Technology PCB Assembly
The transformation of printed circuit board assembly has created a situation with a lot of unforeseen complications, such that modern electronics are asking for the best of both worlds, that is, the miniaturisation benefits of SMT (Surface Mount Technology) and the strength of through-hole components. The resulting situation has made selective soldering an essential process for manufacturers dealing with mixed-technology assemblies. Selective soldering is a precise process that applies solder only to ......
How to Achieve Perfect PCB Soldering: Physics, Processes, and Best Practices
Soldering is often misunderstood as simply “gluing” two pieces of metal together on the surface. In reality, PCB soldering is a complex physico-chemical process governed by thermodynamics, surface energy, and metallurgy. For PCB design engineers and hardware startups, mastering the science behind a reliable solder joint is often the decisive factor between a prototype that fails in the field and a product that scales smoothly into mass production. During prototyping, engineers frequently rely on manua......
How to Use Solder Paste: Stencil, Syringe, and Soldering Iron Methods
Key Takeaways: How to Use Solder Paste ● Solder paste must be applied before component placement and reflowed with a controlled heat profile. ● Most SMT defects are caused by incorrect paste volume, poor storage, or improper heating. ● Stencil printing provides the most consistent and reliable results. ● Manual methods (syringe or iron) are suitable only for low-density or repair work. Solder paste is the foundation of modern electronics assembly. In simple terms, it is a mixture of microscopic solder......
Through-Hole vs Surface Mount Components: Pros, Cons, PCB Design and Assembly Trade-Offs
When designing a PCB, engineers should choose between through-hole components and surface mount devices (SMD). This choice directly impacts board size, assembly cost, mechanical reliability, and electrical performance. Understanding the key differences in Through-Hole vs SMD helps designers optimize both manufacturability and long-term reliability. In modern PCB manufacturing, both technologies are widely used. Many designs adopt a mixed-technology approach, combining SMDs for high-density circuits wi......
SMT vs Through Hole: Which PCB Assembly is Most Cost-Effective?
Performance and cost in the realm of electronics production depend on choosing the correct assembly method. Of the several approaches accessible, Surface Mount Technology (SMT) and Through-Hole Technology (THT) are the two most often used ones for PCB assembly. These two assemblies can be combined to create some products or used as individual technologies. Though seemingly little, this variance affects several aspects including board design, materials and techniques employed, heat dissipation, and rel......