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What is Soldering Flux and Why It is Critical for PCB Soldering

Blog  /  What is Soldering Flux and Why It is Critical for PCB Soldering

What is Soldering Flux and Why It is Critical for PCB Soldering

July 26, 2025

Solder flux is sometimes mistaken for solder paste. Solder paste is made up of tiny balls of solder used in SMT, whereas solder flux is a basic gel utilized with every solder joint to perform properly on the surface. To create an effective bond, solder flux is combined with soldering wire or solder substance. Flux is used to make bonds reliable? But how this is the main question here. Here is your answer:

  • It guarantees that despite normal wear and tear, the solder junction won't break.
  • It eliminates oxide coatings that develop on the surface of the metals being soldered.

Flux facilitates the soldering and desoldering operations. which will lessen the mistakes brought on by dry soldering and loose junctions. We'll go into great detail on solder flux in this post, including its definition, its operation, and the various kinds of flux used in electronics. In electronic soldering, flux is essential since it speeds up the procedure and guarantees dependable connections between parts.


What is Solder Flux?



Solder Flux



As we have seen earlier, It can be referred to as a chemical substance called flux. It usually appears inside the solder wire as a paste, liquid may be sometime in the core of the wire itself. As cleared from the working concept, It helps in the preparation of metal surfaces for soldering by eliminating oxides and improving solder flow. Additionally, flux forms a protective layer on the metal surfaces to prevent re-forming of oxides during soldering. Flux makes sure that the solder flows uniformly and smoothly by lowering its surface tension. Which results in robust and dependable solder junctions. By the way, what it does is given in detailed format here in the next section.


Why Is Solder Flux Important?


1. Oxide Removal: It is used to remove microscopic oxide layers on copper and other metals.

2. Prevents Further Oxidation: It forms a temporary barrier to protect already cleaned surfaces during soldering.

3. Improved Wetting: It reduces surface tension of molten solder which allows it to spread and form complete bonds.


Components of Solder Flux:


The main components of flux include:

Cleaning Agent: It basically removes contaminants present on the surface of PCB.

Activator: It is a special chemical like ammonium chloride or hydrochloric acid that eliminates oxides and dirt.

Additives: They improve wetting in joints and help solder to adhere to the PCB joints.


How Flux Works During Soldering:


1. Before Heating: When flux spreads over the metal surface and then starts to chemically break down the oxide layers.

2. During Heating: In this stage flux starts melting and becomes chemically active to aggressively remove oxides.

3. Soldering: As the solder melts the flux ensures it adheres to the clean metal which forms strong mechanical and electrical bonds.

4. After Soldering: Residues may remain on the PCB after working, which should be necessary to avoid long-term reliability problems.


Soldering Flux Categories:


  • Rosin Flux
  • Organic Flux
  • Inorganic Flux
  • No-Clean Flux
  • Water Soluble Flux


1) Rosin flux: When heated, the flux should ideally flow readily and remove oxides rapidly. When liquid, rosin flux is acidic. It solidifies and becomes inert when it cools. Rosin flux can be left on a printed circuit board without damaging the circuit since it is inert when solid, unless the circuit warms up to the point where the rosin may turn liquid and erode the connection.



Rosin flux



2) Organic flux: Compared to rosin fluxes, organic acid fluxes are more potent and remove oxides faster. The organic acid flux's water-soluble properties make it simple to clean the PCB using ordinary water. Citric, lactic, and stearic acids are examples of common weak acids that are utilized in organic acid flux.



Organic flux



3) Inorganic flux: After using inorganic acid flux, the surfaces must be thoroughly cleaned to get rid of any corrosive residues that, if left on, could weaken or ruin the solder bond. composed of a variety of substances. Stronger metals are used with it. Because of its strength, electrical circuits are not advised to use it. Plumbing is its primary use. Stronger metals like copper, brass, and stainless steel are better suited for it. It is a mixture of stronger acids such as ammonium chloride and HCL.


4) No-Clean Flux: They are made from synthetic/natural resins. However, they often have a far lower concentration of natural gum rosin than those found in R Type (R, RMA, and RA) flux solutions. The purpose of no-clean fluxes was to assist circuit board producers in avoiding the time and cost associated with board cleaning. Compared to the traditional R type flux, no-clean fluxes leave a lot less residue, and this residue is typically not enough to disrupt board functionality or result in corrosion-related failures over time.



No-Clean Flux



5) Water Soluble (Aqueous) Flux: For board makers subject to strict environmental restrictions, this is one method of lowering VOC emissions. A water rinse should be used to get rid of any residue from the water-soluble resins that are typically used in water-soluble fluxes. Some water-soluble fluxes don't require alcohol flux solution for cleaning because they are water-based solutions.



Water Soluble (Aqueous) Flux



Flux vs Solder Paste: What is the Difference?



What is the Difference of Flux and Solder Paste:



Conclusion:





In summary, solder flux is essential to the performance of electronic assemblies. All of a flux's functions, from oxide elimination to enhanced wetting, are covered in depth above. The best solder junctions are ensured by selecting the appropriate flux and using it appropriately. With the aid of the provided data, the right decision can be made; it should be based on the application kind and requirements. Every electronics engineer must comprehend flux chemistry and application as electronics continue to progress toward high-density designs and downsizing.