JLCPCB Launches OSP for 6-Layer PCBs: High Quality at No Extra Charge

JLCPCB has officially expanded its manufacturing capabilities by launching the Organic Solderability Preservative (OSP) surface finish for 6-layer PCBs.  

Commonly utilized as a highly effective anti-oxidation treatment for exposed copper, OSP leverages specialized chemical compounds to form an ultra-thin, protective layer on the copper surface. This mature and refined process has been trusted for decades across high-precision industries, including smartphones, industrial control systems, medical equipment, automotive electronics, and more.

Why OSP is the Ideal Choice for Your Next 6-Layer Project

By making OSP a primary surface finish for 6-layer boards, JLCPCB delivers a solution that optimizes surface quality, keeps production costs lean, and offers unmatched after-sales rework flexibility.

1. Excellent Surface Planarity for BGA Packages
2. Unlike traditional Hot Air Solder Leveling (HASL)—which suffers from thickness variations and surface-planarity limitations—OSP provides a perfectly flat, uniform, and smooth surface. This makes it exceptionally well-suited for modern, high-density circuitry and tight-pitch BGA packages. Due to these structural limitations, JLCPCB has strictly excluded HASL for 6-layer and advanced PCBs since day one, positioning OSP as the premier choice.
3. Significant Cost Savings (Save ~$22/㎡)
4. As global gold prices fluctuate, Electroless Nickel Immersion Gold (ENIG) demands an extra premium of approximately $22 per square meter. In contrast, JLCPCB offers the OSP surface finish at no additional charge, enabling engineers and businesses to dramatically slash manufacturing overhead without compromising board quality.
5. Mature Process Supported by Leading Industry Supplies
6. JLCPCB operates a fully optimized, robust OSP production line. We source our chemical formulations exclusively from a world-class OSP supplier, all backed by a rigorous quality management system. As a platform serving millions of global users, a process is only deployed to our mass production lines after proving completely reliable and stable.
7. Free OSP Finish for $2 6-Layer PCBs
8. JLCPCB’s 6-layer PCB prototyping is available starting at just $2, giving customers access to the high-quality OSP surface finish with zero additional fees. ENIG is no longer offered as a free surface finish option; customers selecting ENIG can upgrade for an additional fee.
9. Hassle-Free Reworkability
10. If visual oxidation is identified prior to PCBA soldering, OSP boards can easily be routed back to the line for a fresh chemical stripping and re-application, restoring them to mint condition. This makes OSP far easier to reprocess compared to leaded/lead-free HASL, while ENIG generally cannot be reworked once oxidized. JLCPCB provides free OSP rework during the warranty period (including round-trip shipping) and continues to offer free rework even after the warranty expires. Furthermore, OSP is an eco-friendly, lead-free alternative to traditional finishes.

Key Performance Specifications

• Soldering Cycles: Supports up to four thermal cycles in total (two reflow cycles and two wave-soldering cycles).
• Shelf Life: Unopened finished boards maintain a typical shelf life of up to three months.

Application Scope & Guidelines

OSP has been thoroughly proven across a vast spectrum of advanced electronics:

• Advanced HDI PCBs & Smart Displays: Ideal for ultra-fine traces and micro-BGA pads.
• High-Speed Server Backplanes: Capable of handling 20- to 32-layer configurations requiring high-speed signal integrity.
• High-Frequency & Rigid-Flex Layouts: The ultra-thin layer preserves premium high-frequency performance and adapts seamlessly to rigid-flex combinations.
• Automotive Precision Systems: Certified for domain controllers and battery management systems (BMS), reliably enduring extreme high/low temperatures and damp-heat testing.

Where OSP is Not Recommended:

To ensure the best field reliability, please note that OSP should be avoided for:

• Gold Finger Connectors: Edge connectors are incompatible with OSP.
• Castellated Holes: Side-plated modules may suffer from poor secondary solderability if stored too long before the final assembly.
• Military-Grade Hardware: Harsh military environments dictate stringent standards that standard OSP cannot meet, where leaded HASL remains the industry standard.
• Extreme Storage: Not recommended for long-term unsealed storage or designs requiring an unusually high number of reflow steps.

Experience OSP Today

With the launch of OSP for 6-layer PCBs, JLCPCB continues its commitment to bringing industrial-grade quality to the global engineering community at unbeatable prices. Head over to the JLCPCB Quote Page today to select OSP for your next multi-layer design!