PCB Technical Guidelines
PCB Technical Guidelines
- JLC's aluminum substrates are now available
- JLC's 'Thermal-electric Separation Copper Substrate' is Now in Production
- Difference and Tolerance Explanation Between Via and Pad Holes in PCB
- Common Compatibility Issues with Altium Designer and PADS Software
- Technical Guide: Making Solder Overflow Slots
- Design Optimization: Prevent Breakage in Narrow Board Areas
- Design Optimization: Instructions for Chamfering Gold Fingers
- Process Limitation for Cross-shaped Slot Holes - Please Read Before Ordering
- FPC Imposition Design Specification
- PCB Design Instructions for Edge Plating
- User Guide to the JLCPCB Impedance Calculator
- BGA Design Guidelines - PCB Layout Recommendations for BGA packages
- PCB Panelization
- Design Optimization: Specifications for Adding Process Edges and Positioning Holes
- PCB Design Minesweeping – Common Mistakes When Using Altium Designer
- How to Design Multi-color Silkscreen using EasyEDA
- EasyEDA Flex PCB Design User Guide
Welcome back, may I help you?