JLC's aluminum substrates are now available

Responding to widespread customers' demands, JLC Group officially launched aluminum substrates in mid-May 2021. Additionally, in April 2022, the more efficient 'Thermal-electric Separation Copper Substrate' was also introduced. Click here to check it out.

■ Introduction to Aluminum Substrates

Aluminum substrates are metal-based copper-clad laminates renowned for their excellent heat dissipation properties. Typically, they comprise a circuit layer (copper foil), an insulation layer, and a metal substrate. These substrates are extensively employed in applications requiring efficient heat management, such as LED lighting, mixed integrated circuits, automotive components, office automation devices, and high-power electrical equipment.

■ Aluminum Substrate Manufacturing Capabilities

1) Layers: 1 layer (single-sided aluminum substrate)

2) Board thickness: 0.8mm, 1.0mm, 1.2mm, 1.6mm (1OZ copper thickness)

3) Minimum drilling: 0.65mm

4) Minimum size: 5*5mm, maximum size: 602*506mm (generally uses V-cut for panelization, panel dimensions after cutting need to be larger than 70*70mm)

5) Minimum Trace Width and Spacing: 0.10mm/0.10mm (designs with wider traces are recommended). Full AOI inspection + selective flying probe test are included at no extra cost.

8) Surface Finish: Copper surfaces not covered by solder mask are treated with either leaded or lead-free tin spraying.( Immersion gold and bare copper finishes are not available).

9) Shipment type: Single-piece shipment, panelization V-CUT/side milling (minimum milling slot width: 1.6mm). Stamp hole panelization is not recommended but can be accommodated under special circumstances.

■ Aluminum Substrate Material Parameters

Important Reminders

1) Single-sided aluminum substrates use "Hangyu HY-7000" and "Huazheng HA60"; currently, specifying board material manufacturers when ordering is not supported.

2) Single-sided aluminum substrates generally solder SMT components onto the copper foil layer. It’s advised not to solder through-hole components to avoid short circuits caused by the legs touching the aluminum base.

3) Voltage resistance: 3000V. This refers to the material's voltage resistance, not that of the finished product. Kindly specify if there are any special conditions.

4) It's advised not to print characters on the aluminum base due to weak adhesion, especially for white characters, which may not be clear. If necessary, please note this when placing an order.

5) Shaping (CNC) requires a minimum milling cutter diameter of 1.6mm; therefore, slot holes or panel gaps need to be ≥1.6mm.

6) Shaping (V-CUT) utilizes a diamond V-cut tool to reduce burrs. The cut is deeper on the aluminum side than on the copper foil side to prevent warping and defects on the circuit face.

7) Aluminum substrates generally do not recommend stamp hole panelization. If insisted upon, please note this when ordering. In this case, we assume customers accept the difficulty of splitting the board and the possibility of burrs and protrusions..