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BYH12-200S01

Manufacturer
Bellnix Co., LTD
MFR.Part #
BYH12-200S01
JLCPCB Part #
C7092708
Package
DIP,32.6x20.4mm
Description
200V 1mA 11V~16V 200mW DIP,32.6x20.4mm Power Modules ROHS
Datasheet
Download
Source
JLCPCB
Assembly Type
Wave Soldering
CAD Model
PCB Footprint or Symbol
ECCN
EAR99
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.

BYH12-200S01 technical specifications, attributes, and parameters.

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BYH12-200S01 symbol, PCB footprint from the free EasyEDA PCB design tool.

BYH12-200S01 datasheets or manufacturer documentation.

Datasheet: BYH12-200S01 Datasheet (PDF)

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