Latest News
Free Via-in-Pad on 6-20 Layer PCBs with POFV
For international market, JLCPCB via-in-pad on 6- 20 layer PCBs are upgraded to POFV (Plated Over Filled Via) for free and will continue to be the free default for all upcoming high layer count boards. This means its costs will no longer be added to the total price whether it’s a sample or batch order, allowing everyone to truly enjoy the benefits of JLCPCB’s advanced fabrication. (POFV for 4-layer PCBs still requires charges.) Via-in-pad has been widely used in high-end PCBs for many years now, but t......
Product Update
Nov 02, 2022
Great news! JLCPCB aluminum substrates are now available!
Responding to strong market interest, JLCPCB Group was pleased to announce the launch of its aluminum substrate in mid-May 2021. Further expanding its product portfolio, the company introduced a high-performance Direct Bonded Copper (DBC) substrate in April 2022, designed for enhanced heat dissipation. Aluminum Substrate Overview An aluminum substrate is a type of metal core copper clad laminate (MCCL) known for its excellent heat dissipation properties. A standard single-layer aluminum substrate typi......
Product Update
Oct 13, 2022
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