Layer

1-6 layer

1-6 copper layers PCB prototypes

Material

FR-4

FR-4 board material

Max. Dimension

400x500mm

Maximum dimension is 400x500mm

Dimension Tolerance (Outline)

±0.2mm

±0.2mm for CNC routing, and ±0.2mm for V-scoring

Thickness

0.4--2.0mm

0.4/0.6/0.8/1.0/1.2/1.6/2.0mm

Thickness Tolerance ( T≥1.0mm)

± 10%

e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm（T－1.6×10%）to 1.76mm（T＋1.6×10%)

Thickness Tolerance ( T<1.0mm)

± 0.1mm

e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm（T-0.1）to 0.9mm（T+0.1).

Min. Trace

6mil

Minimum trace width is 6 mil. More than 6mil is recommended to save cost

Min. Spacing 

6mil

Minimum spacing is 6 mil. More than 6mil is recommended to save cost

   Finished Outlayer Copper 

   1 oz/2 oz (35um/75um)

   Finished outlayer copper weight is 1oz or 2oz

Finished Innerlayer Copper

0.5 oz (17um)

Finished innerlayer copper weight is 0.5 oz only

Drill Hole Size

0.3--6.3mm

Min. drill size is 0.3mm, Max. drill size is 6.3mm. Any holes greater than 6.3mm will charge extra fee

Annular Ring

≥6mil

Annular ring surrounded by traces should be equal to or larger than 6mil(0.153mm)

Hole Size Tolerance

±0.08mm

e.g. For the 0.6mm hole, the finished hole size between 0.52mm to 0.68mm is acceptable.

Solder Mask

LPI

Liquid Photo-Imageable Solder Mask is the most common mask type.  

Min. Character Width

≥6mil

Characters width less than 6mil(0.153mm) will be unidentifiable.

Min. Character Height

≥1mm

Characters height less than 1mm will be unidentifiable.

  Trace to Outline

   ≥0.3mm

   Rounting: Trace to Outline≥0.3mm; V-scoring: Trace to V-cut line≥0.4mm

Panelization without space

0mm

For V-scoring panelization, set the space between boards to be 0mm

Panelization with space

2mm

For Rounting panelization,set the space between boards to be ≥2mm.

Copper Hatching with Pads

Hatch

We will apply Copper Hatching if your PCBs designed with Pads.

Slot Drawing with Pads

Outline

Please use Outline to design if there are many non-plated (NPTH) holes.

Protel/dxp Solder Layer

Solder Layer

Do not mistake the Paste Layer as Solder Layer.

Protel/dxp Outline Layer

Keepout Layer/Mechanical Layer

Only choose one from Keepout Layer or Mechanical Layer as outline.

Min. Half Hole Diameter

0.6mm

Half hole is a special technology, so half hole diameter should be greater than 0.6mm.

Soldermask Bridge

0.1mm

Solderbridge is not available now