Layer

1-6 layer

1-6 copper layers PCB prototypes
(Don't support Blind/Buried Vias)

Controlled Impedance PCB

4/6 layer

No extra charge and only accept our
default layer stack-up

Controlled Impedance PCB Layer Stackup
JLCPCB Impedance Calculator

Material

FR-4

FR-4 board material

Max. Dimension

400x500mm

For Single&Double Layer, the maximum dimension is 400x500mm;
For Multi Layer PCB, the maximum dimension is 390x390mm.

Dimension Tolerance 
(Outline)

±0.2mm

±0.2mm for CNC routing, and ±0.2mm for V-scoring

Solder Mask

LPI

Liquid Photo-Imageable Solder Mask is the most common mask type.  
No extra fee for different color of solder mask.

Thickness

0.4--2.0mm

0.4/0.6/0.8/1.0/1.2/1.6/2.0mm

Thickness Tolerance
( Thickness≥1.0mm)

± 10%

e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%)

Thickness Tolerance 
( Thickness<1.0mm)

± 0.1mm

e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1).

Finished Outer Layer Copper 

1 oz/2 oz (35um/75um)

Finished outer layer copper weight is 1oz or 2oz

Finished Inner Layer Copper

0.5 oz (17um)

Finished inner layer copper weight is 0.5 oz only

Min. Trace

3.5mil

For Single&Double Layer PCB, the minimum trace width is 5 mil;
For Multi Layer PCB, the minimum trace width is 3.5mil.

Min. Spacing 

3.5mil

For Single&Double Layer PCB, the minimum spacing is 5 mil;
For Multi Layer PCB, the minimum spacing is 3.5mil.

Min. Via hole size

0.2mm

For Single&Double Layer PCB, the minimum via hole size is 0.3mm;
For Multi Layer PCB, the minimum via hole size is 0.2mm.

Min. Via diameter

0.45mm

For Single&Double Layer PCB, the minimum Via diameter is 0.6mm;
For Multi Layer PCB, the minimum via diameter is 0.45mm.

Via To Trace

≥5mil

Minimum distance between via(plated holes) and trace is 5mil.

Drill Hole Size

0.2--6.3mm

Min. drill size is 0.2mm, Max. drill size is 6.3mm.

Hole Size Tolerance

±0.08mm

e.g. For the 0.6mm hole, the finished hole size between 0.52mm to 0.68mm is acceptable.

Annular Ring

≥3mil

Annular ring surrounded by traces should be equal to or larger than 3mil

Min. Character Width

≥6mil

Characters width less than 6mil(0.153mm) will be unidentifiable.

Min. Character Height

≥32mil

Characters height less than 32mil will be unidentifiable.

Trace to Outline

≥0.2mm

Ship as individual board(Rounting): 
Trace to Outline ≥0.2mm; 

Ship as panel with V-scoring: 
Trace to V-cut line ≥0.4mm

Panelization without space

0mm

Panelization with space

≥2mm

Make sure the space between boards should be ≥2mm, otherwise it will be hard to process for rounting. 

Min. Edge Rails

3mm

Copper Hatching with Pads

Hatch

We will apply Copper Hatching if your PCBs designed with Pads.

Slot Drawing with Pads

Outline

Please use Outline to design if there are many non-plated (NPTH) holes.

Protel/dxp Solder Layer

Solder Layer

Do not mistake the Paste Layer as Solder Layer.

Protel/dxp Outline Layer

Keepout Layer/Mechanical Layer

Only choose one from Keepout Layer or Mechanical Layer as outline. 

Min. Half Hole Diameter

0.6mm

Half hole is a special technology, so half hole diameter should be greater than 0.6mm. 

Soldermask Bridge/
Blind and buried vias

Soldermask Bridge/Blind and buried vias are not available now