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1-6 copper layers PCB prototypes
(Don't support Blind/Buried Vias)
Controlled Impedance PCB
No extra charge and only accept our
default layer stack-up
FR-4 board material
For Single&Double Layer, the maximum dimension is 400x500mm;
For Multi Layer PCB, the maximum dimension is 300x300mm.
±0.2mm for CNC routing, and ±0.2mm for V-scoring
Liquid Photo-Imageable Solder Mask is the most common mask type.
No extra fee for different color of solder mask.
e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%)
e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1).
Finished Outer Layer Copper
1 oz/2 oz (35um/75um)
Finished outer layer copper weight is 1oz or 2oz
Finished Inner Layer Copper
0.5 oz (17um)
Finished inner layer copper weight is 0.5 oz only
For Single&Double Layer PCB, the minimum trace width is 5 mil;
For Multi Layer PCB, the minimum trace width is 3.5mil.
For Single&Double Layer PCB, the minimum spacing is 5 mil;
For Multi Layer PCB, the minimum spacing is 3.5mil.
Min. Via hole size
For Single&Double Layer PCB, the minimum via hole size is 0.3mm;
For Multi Layer PCB, the minimum via hole size is 0.2mm.
Min. Via diameter
For Single&Double Layer PCB, the minimum Via diameter is 0.6mm;
For Multi Layer PCB, the minimum via diameter is 0.45mm.
Via To Trace
Minimum distance between via(plated holes) and trace is 5mil.
Drill Hole Size
Min. drill size is 0.2mm, Max. drill size is 6.3mm.
Hole Size Tolerance
e.g. For the 0.6mm hole, the finished hole size between 0.52mm to 0.68mm is acceptable.
Annular ring surrounded by traces should be equal to or larger than 3mil
Min. Legend Line Width
Legend Line width less than 6mil(0.153mm) will be unidentifiable.
Min. Text Height
Text height less than 32mil will be unidentifiable.
Trace to Outline
Ship as individual board(Routing):
Trace to Outline ≥0.2mm;
Ship as panel with V-scoring:
Trace to V-cut line ≥0.4mm
Panelization without space
Panelization with space
Make sure the space between boards should be ≥2mm, otherwise it will be hard to process for routing.
Min. Edge Rails
Copper Hatching with Pads
We will apply Copper Hatching if your PCBs designed with Pads.
Slot Drawing with Pads
Please use Outline to design if there are many non-plated (NPTH) holes.
Protel/dxp Solder Layer
Do not mistake the Paste Layer as Solder Layer.
Protel/dxp Outline Layer
Keepout Layer/Mechanical Layer
Only choose one from Keepout Layer or Mechanical Layer as outline.
Min. Half Hole Diameter
Half hole is a special technology, so half hole diameter should be greater than 0.6mm.
Blind and buried vias
Soldermask Bridge/Blind and buried vias are not available now