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WAFER-MX3.0-08PJK-MB

Manufacturer
XUNPU
MFR.Part #
WAFER-MX3.0-08PJK-MB
JLCPCB Part #
C7588032
Package
P=3mm
Description
3mm 2x4P 4 2 3mm P=3mm Housings (Wire To Board / Wire To Wire ) ROHS
Datasheet
Download
Source
JLCPCB
Assembly Type
Wave Soldering
CAD Model
PCB Footprint or Symbol
ECCN
-
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WAFER-MX3.0-08PJK-MB technical specifications, attributes, and parameters.

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WAFER-MX3.0-08PJK-MB symbol, PCB footprint from the free EasyEDA PCB design tool.

WAFER-MX3.0-08PJK-MB datasheets or manufacturer documentation.

Datasheet: WAFER-MX3.0-08PJK-MB Datasheet (PDF)

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