W29N04GVBIAF TR

Manufacturer

Winbond Elec

MFR.Part #

W29N04GVBIAF TR

JLCPCB Part #

C17508965

Package

FBGA-63(11x9)

Description

2.7V~3.6V 4Gbit FBGA-63(11x9) NAND FLASH ROHS

Datasheet

Download

Source

JLCPCB

Assembly Type

Wave Soldering

A PCB assembly fixture is needed to protect and support this part during the assembly process.

CAD Model

PCB Footprint or Symbol

ECCN

3A991B1A

MSL Level

Moisture Sensitivity Level (MSL) ratings range from 1 to 6, with MSL 6 being the most sensitive. Normally,components with MSL ratings of 5 or higher require baking to prevent damage from absorbed moisture during reflow soldering. Learn More>

MSL 3