* Images are for reference only
FI-B03D
- Manufacturer
- MORNSUN(金升阳)
- MFR.Part #
- FI-B03D
- JLCPCB Part #
- C5350334
- Package
- DIP,25.4x25.4mm
- Description
- MORNSUN Guangzhou S& T FI-B03D
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- CAD Model
- PCB Footprint or Symbol
- ECCN
- EAR99
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot
be shipped separately.
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In-stock Item Pricing
Qty Unit Price
1+
$4.6530
10+
$4.0875
63+
$3.7515
126+
$3.4110
504+
$3.2550
1008+
$3.1845
The component is currently unavailable for purchase but can still be used in assembly.
You may send us this part for your future PCBA orders.
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