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BGA777L7E6327

Manufacturer
Infineon Technologies
MFR.Part #
BGA777L7E6327
JLCPCB Part #
C3191822
Package
XFDFN-6-EP
Description
1.2dB 2.3GHz~2.7GHz 17dB UMTS XFDFN-6-EP RF Amplifiers ROHS
Datasheet
Download
Source
JLCPCB
Assembly Type
Wave Soldering
CAD Model
PCB Footprint or Symbol
ECCN
EAR99
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.

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BGA777L7E6327 technical specifications, attributes, and parameters.

BGA777L7E6327 symbol, PCB footprint from the free EasyEDA PCB design tool.

BGA777L7E6327 datasheets or manufacturer documentation.

Datasheet: BGA777L7E6327 Datasheet (PDF)

In Stock: 0

Minimum: 9

Full Reel: 7500

Total: $0

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