* Images are for reference only
BGA771L16E6327
- Manufacturer
- Infineon Technologies
- MFR.Part #
- BGA771L16E6327
- JLCPCB Part #
- C3191820
- Package
- XFDFN-6-EP
- Description
- 1.05dB 15.8dB UMTS XFDFN-6-EP RF Amplifiers ROHS
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- CAD Model
- PCB Footprint or Symbol
- ECCN
- EAR99
BGA771L16E6327 technical specifications, attributes, and parameters.
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- 1
Step 1 - Pre-order the parts you need at JLCPCB
- 2
Step 2 - To assemble the part you pre-ordered, just place a PCBA order at JLCPCB
- 3
Step 3 - JLCPCB produces and assembles your boards in 3 days.
![](/ssr/img/assembly-poster.af4832e.png)
BGA771L16E6327 symbol, PCB footprint from the free EasyEDA PCB design tool.
BGA771L16E6327 datasheets or manufacturer documentation.
Minimum: 5
Full Reel: 7500
Total: $0.00
![](/ssr/img/calculate_icon@2x.9d72fcf.png)
Available Order Qty: 0
In-stock Item Pricing