Multilayer high precision PCB’s with impedance control

JLCPCB can produce High-precision multilayer board with capabilities listed in below table.

Min. Trace width/Spacing	Min. Via	Min. BGA
3.5mil	0.2mm	0.3mm

It is very convenient for customers to conduct impedance matching design according to JLCPCB’s laminated structure and related parameters. The PCB will be produced in accordance with the following stackup strictly.

Controlled Impedance PCB Parameters and Stackup

1.Prepreg dielectric constant:

Prepreg type	Dielectric constant
7628	4.6
2313	4.05
2116	4.25

2.Solder mask Parameters

Solder mask thickness over the laminate	Solder mask thickness over traces	Solder mask dielectric constant
0.8mil	0.5mil	3.8

For your convenience, we have designed a Impedance Calculator to help you calculate the impedance and trace width you need.

4-Layer Impedance Control Stackup

Thickness

0.8mm1.0mm1.2mm1.6mm2.0mmCurrent layer:4-layer

a) JLC7628 Stackup:

Layer	Material Type	Thickness
Top Layer1	Copper	0.035 mm
Prepreg	7628*1	0.2 mm
Inner Layer2	Copper	0.0175 mm	1.1mm (with copper core)
Core	Core	1.065 mm
Inner Layer3	Copper	0.0175 mm
Prepreg	7628*1	0.2 mm
Bottom Layer4	Copper	0.035 mm

b) JLC2313 Stackup:

Layer	Material Type	Thickness
Top Layer1	Copper	0.035 mm
Prepreg	2313*1	0.1 mm
Inner Layer2	Copper	0.0175 mm	1.3 mm (with copper core)
Core	Core	1.265 mm
Inner Layer3	Copper	0.0175 mm
Prepreg	2313*1	0.1 mm
Bottom Layer4	Copper	0.035 mm

6-Layer Impedance Control Stackup

Thickness

1.2mm1.6mm2.0mmCurrent layer:6-layer

b) JLC2313 Stackup:

Layer	Material Type	Thickness
Top Layer1	Copper	0.035 mm
Prepreg	2313*1	0.1 mm
Inner Layer2	Copper	0.0175 mm	0.6 mm (with copper core)
Core	Core	0.565 mm
Inner Layer3	Copper	0.0175 mm
Prepreg	2116*1	0.127 mm
Bottom Layer4	Copper	0.0175 mm	0.6 mm (with copper core)
Core	Core	0.565 mm
Inner Layer5	Copper	0.0175 mm
Prepreg	2313*1	0.1 mm
Bottom Layer6	Copper	0.035 mm

Note: The 6-Layer board temporarily only provides JLC2313 Stackup.