Multilayer high precision PCB’s with impedance control

JLCPCB can produce High-precision multilayer board with capabilities listed in below table.

Min. Trace width/SpacingMin. ViaMin. BGA3.5mil0.2mm0.3mm

It is very convenient for customers to conduct impedance matching design according to JLCPCB’s laminated structure and related parameters. The PCB will be produced in accordance with the following stackup strictly.

Controlled Impedance PCB Parameters and Stackup

1.Prepreg dielectric constant:

Prepreg typeDielectric constant76284.623134.0521164.25

2.Solder mask Parameters

Solder mask thickness over the laminateSolder mask thickness over tracesSolder mask dielectric constant0.8mil0.5mil3.8

For your convenience, we have designed a Impedance Calculator to help you calculate the impedance and trace width you need.

4-Layer Impedance Control Stackup

Thickness

0.8mm1.0mm1.2mm1.6mm2.0mmCurrent layer:4-layer

a) JLC7628 Stackup:

LayerMaterial TypeThicknessTop Layer1Copper0.035 mmPrepreg7628*10.2 mmInner Layer2Copper0.0175 mm1.1mm (with copper core)CoreCore1.065 mmInner Layer3Copper0.0175 mmPrepreg7628*10.2 mmBottom Layer4Copper0.035 mm

b) JLC2313 Stackup:

LayerMaterial TypeThicknessTop Layer1Copper0.035 mmPrepreg2313*10.1 mmInner Layer2Copper0.0175 mm1.3 mm (with copper core)CoreCore1.265 mmInner Layer3Copper0.0175 mmPrepreg2313*10.1 mmBottom Layer4Copper0.035 mm

6-Layer Impedance Control Stackup

Thickness

1.2mm1.6mm2.0mmCurrent layer:6-layer

b) JLC2313 Stackup:

LayerMaterial TypeThicknessTop Layer1Copper0.035 mmPrepreg2313*10.1 mmInner Layer2Copper0.0175 mm0.6 mm (with copper core)CoreCore0.565 mmInner Layer3Copper0.0175 mmPrepreg2116*10.127 mmBottom Layer4Copper0.0175 mm0.6 mm (with copper core)CoreCore0.565 mmInner Layer5Copper0.0175 mmPrepreg2313*10.1 mmBottom Layer6Copper0.035 mm

Note: The 6-Layer board temporarily only provides JLC2313 Stackup.