This website requires JavaScript.
Coupons APP Download
Ship to
Help Center
Medium & Low Temperature Solder Paste Service

Medium & Low Temperature Solder Paste Service

Last updated on Jun 10, 2026

Service Description

JLCPCB provides medium and low-temperature solder paste options to meet the soldering temperature requirements of different electronic components.

Supported Order Types

Medium and low temperature solder paste is available for Standard PCBA orders only.

Supported PCB surface finishes:

  • Lead-Free HASL
  • ENIG

For HASL (with lead) surface finish, only high-temperature solder paste is supported.

Functions and Benefits

JLCPCB's medium and low temperature solder paste service accommodates components with different temperature tolerances. By reducing the peak reflow temperature, it helps minimize thermal damage and warpage risks for temperature-sensitive components.

The service is also compatible with specific PCB surface finishes, helping improve soldering yield and supporting the assembly requirements of complex components.

Pricing

Medium Temperature Solder Paste

  • Reflow oven temperature: 210 ± 5°C
  • Additional charge: approximately USD 32

Low Temperature Solder Paste

  • Reflow oven temperature: 180 ± 5°C
  • Additional charge: approximately USD 80

How to Select This Service

As shown below, please select:

Advanced Options → Solder Paste (Medium Temp.)

If low temperature solder paste is required, please add a note in the PCBA Remark section.

solder paste temperature option

Notes

1. Only one type of solder paste can be selected per order. The selected solder paste is used for SMT reflow soldering.

2. JLCPCB recommends selecting the appropriate solder paste based on the soldering temperature requirements specified in the component datasheets. Compared with high-temperature solder paste, solder joints formed using medium or low temperature solder paste may have lower mechanical strength and may exhibit a darkened appearance. Therefore, their use is not recommended unless required by the application.