JLCPCB's High Precision 6-8 Layer PCBs Starting from Just $2!

Currently, on JLCPCB, we have launched several promotions for multilayer PCB prototyping. We no longer have extra charges for via-in-pad on 6-20 layer PCBs.

For a limited time,JLCPCB is offering $10 OFF on JLCPCB 6-Layer PCBs.

The quality of JLCPCB 6-layer PCBs with ENIG & via-in-pad

1) Board 1

Layer: 6 layers

size: 78.05mm*70.37mm

Application: modify hardware accelerator board to FPGA development board

48% of the vias placed on the pads and all BGA packages using vias on the pad (VIA).

4 times closer to the via-in-pad

2）Board 2

Layer: 6 layers

size: 100.05mm*135.05mm

Application: Part of an RF synthesizer for RF signal switching and self-calibration

26% of the vias placed on pads.

4 times closer to the via-in-pad

3）Board 3

Layer: 6 layers

size: 180.07mm *137.14mm

Application: wireless terminal

10% of the vias placed on pads. Via-in-pad on all QFN packages.

4 times closer to the via-in-pad

Free ENIG & via-in-pad, why are they important?

For multilayer PCBs, especially for 6 layers and above, ENIG and via-in-pad are both critical tools to improve the PCB performance.

For 6 layers and above we usually recommend ENIG as the surface finish. Because these boards are often used with high lead-density parts that need a very flat, even surface to solder onto. ENIG gives solder pads excellent flatness, better conductivity, and solderability to help with this.

On the other hand, via in the pad, known as VIP, that the vias are punched on the pads of SMD and BGA parts, is vital as well. JLCPCB Plating Over Filled Via (POFV) manufacturing not only helps to reduce the design engineers' pressure, but greatly improves the PCB quality and electrical performance for higher design effectiveness; it also reduces the volume of the circuit board layout. Enjoy free vis-in-pad for your 6-layer ENIG PCBs on JLCPCB quote page.

How JLCPCB makes via-in-pad?

The four pads on the left-hand side were made with via-in-pad: the via holes in the pads have been plugged with epoxy and then plated over with copper (“capped”) to create an almost-flat surface. The pad on the right-hand side was produced with a regular process and the via hole is exposed; this is undesirable because during reflow soldering the solder can be wicked into the hole then the component will not be totally soldered which could make it easily disconnected.

JLCPCB’s high-quality and stable filled-and-capped vias use a combination of plugging and capping. This process creates the following via structure: In the via-in-pad process, the copper on the finished surface of the PCB is electroplated twice, once for the hole-in-disk hole copper plating, and once for the non-in-disk hole-in-hole copper plating.

The inside of the hole in the disk is first plugged with resin, then cured, and then polished. Therefore, the requirements for the equipment are relatively strict. Usually, a vacuum plugging machine and a resin grinding machine are used. Although more complex to produce, their excellent performance and the convenience they bring into the design process are definitely worth the extra steps.

Allow everyone to benefit from JLCPCB multilayer PCB

JLCPCB has upgraded the via-in-pad process of all 6-20 layer PCBs for free and provides free ENIG to make PCB products more stable and reliable. It is worth mentioning that due to large-scale production capabilities, JLCPCB is able to reduce the cost, allowing everyone to truly enjoy the benefits of the JLCPCB advanced fabrication. Here at JLCPCB, you can also get 1-8 layer PCBs at only $2, and enjoy advanced ENIG & via-in-pad processes at the best price. As a part of the PCB industry, JLCPCB has been constantly improving production while benefiting customers on the budget, allowing more electronic engineers to have high-end circuit board production without high-cost concerns. That's what JLCPCB has always been endeavoring for: Making tech innovation easier.