Technical Guidance: V-Cut Panelization Standards
4 min
- V-cut processing
- Requirements
- Example Panel Layouts
For boards with regular shapes, V-cut panelization can be used. The processing method involves cutting V-shaped grooves of a certain depth into the cross-section of the panel, making it easier to split after component assembly. Due to the nature of V-cut, there may remain thread-like fibers after separation, which can be lightly scraped off. Due to the expansion and cracking of the material during separation, the outer dimensions of V-cut boards have a slightly larger tolerance (±0.4mm). PCBs connected using this method in panelization are referred to as "V-cut panelized boards" (currently, JLCPCB's standard SMT assembly supports V-cut panelization).
V-cut processing
Here are a few key points regarding our V-cut processing:
■ V-Cut Angle: 25 degrees.
■ V-Cut Panel Size: Length and width both need to be 70 mm or more.
■ V-Cut Connectivity: Rectangular boards can be connected on all four sides or on two opposite sides (the minimum width of the connecting edge should be 3 mm, and for board thicknesses of 0.8 mm and below, the minimum width of the connecting edge should be 5 mm).
■ V-Cut Direction: Can only be in a straight line (starting at one end and ending at the other, no skipping), and only double-sided V-cut, not single-sided V-cut.
■ V-Cut Routing Clearance: The copper layer, traces/solder pads, etc., need to be at least 0.4mm away from the V-cut centerline to avoid exposing copper or damaging traces during V-cut (in addition, try to keep mounting holes away from the V-cut line to prevent holes from breaking during separation).
In regular scenarios where V-cut is needed, there is no gap between the boards; for cases where V-cut is not used, the gap between two boards is 1.6 mm or 2 mm.
However, where V-cut edges coincide with routed slots, because the milling tool is circular and cannot reach inside adjacent boards, protruding acute angles can occur after separation. Customers can choose to manually remove these if necessary. If this is inconvenient, you can add a process edge of 3-5mm between boards to allow the milling tool to reach inside and remove the sharp angles.
Considering the requirements for SMT assembly, the appropriate panelization method should be chosen.
A) The distance from the fiducial to the board edge should be appropriate (JLCPCB's SMT requires a minimum of 3.85 mm from the center of the fiducial to the board edge) so that they are not blocked by SMT machine guide rails.
B) For components protruding from the board, empty slots (CNC) should be created on the process edge to facilitate SMT assembly.
C) For board areas that need to be milled out, please mark "CNC" on the same layer as the board outline.
D) For board areas that need to be V-cut, please mark "V-CUT" on the same layer as the board outline.
E) Board edges with arcs or protrusions should not be V-cut. Edges with recessions should avoid V-cut if possible and use milling instead to ensure there are no sharp angles in the recessed slots.
F) The minimum width for load-bearing connecting edges inside the board is 3mm.
Requirements
① For panel designs specified by the customer as text description or outline drawings without gerber files, we make our own adjustments for non-compliant positions (such as mouse bites, connection positions, clearances, etc.). Tooling holes and fiducials should be added by the customer. We do not add data that is not present on the drawings.
② For panel designs provided by the customer as gerber files, if they require tooling holes or fiducials, please add them yourself. Data not present on the drawings will not be added by us.
③ For customer-provided panel layout drawings where unit boards (or process edge) are not identical, our engineering team will by default adjust them to zero spacing panelization. For panels supplied as gerber files, we follow the file's specifications. Click here for more information.
A strong emphasis: To ensure that the PCBs match your stencil and fixture precisely, please download our engineering data from the system to create your stencil and fixture.
Example Panel Layouts
For more cases, please visit: Panelization Issues with Irregular Shapes and Structures.
Keep Learning
Achieving Clean PCB Separation: The Benefits of Professional Depaneling
Note Clean depaneling is a critical final step: a poor split can cause microcracks, trace/solder-joint damage, delamination, and rough edges. Choose the method early based on outline, material/thickness, component edge clearance, volume, and required edge quality—V-scoring for fast straight cuts, routing for complex shapes, and laser for fragile or edge-constrained designs—with IPC criteria guiding controls and inspection. Have you ever broken a PCB off a panel and found rough edges, small cracks alon......
Via Filling Explained: Key Techniques, Benefits, and Solutions for High-Performance PCBs
Note Via filling completely fills plated through-holes and microvias with epoxy or conductive copper paste, followed by planarization and copper capping (POFV). It eliminates voids, solder wicking, and thermal/mechanical issues while enabling reliable via-in-pad designs. Benefits include superior heat dissipation (up to 8 W/m·K), better signal integrity, higher mechanical strength, and improved assembly yields. JLCPCB provides free non-conductive filling + POFV on 6+ layer boards. Ideal for HDI, high-......
How to Choose the Right Prepreg Material for Reliable Multilayer PCB
Have you ever wondered what makes all those copper layers stick to a cross-section of a multilayer PCB? Prepreg material is the answer, and it is of much more importance than most engineers think it is. Choose the prepreg selection wrong, and you are predetermined to delamination, impedance drift, and long-term reliability problems. Prepreg is not only glue. It is a designed composite that determines your dielectric separation, dictates your impedance, affects signal loss, and determines your board be......
PCB Basic 3: Understanding PCB Manufacturing Processes
Welcome to the third installment of our PCB Basics series. In this article, we will unravel the step-by-step process of PCB manufacturing, guiding you through each stage with clarity and precision. Join us as we embark on this educational journey and discover how JLCPCB's advanced manufacturing capabilities and technology together with unparalleled commitment to quality assurance can elevate your PCB designs to the next level. Substrate Selection: Laying the Foundation One of the critical steps in PCB......
Laser Engraving vs. Professional PCB Fabrication : Understanding DIY Limitations and Industrial Advantages
In the conventional approach, we first apply a mask pattern and then remove metals using chemicals. In hobby electronics, using a laser engraver to make circuit boards is an exciting idea. The basic concept is to generate a laser to pattern a copper-clad board. Typically, a bare PCB is first coated with a dark resist layer that protects the copper. Then a laser cutter follows your circuit design to burn away the resist where copper traces should remain. After laser etching, the exposed copper is chemi......
Understanding SMT PCB Boards Technology: An Essential Component of Modern Electronics
Surface Mount Technology (SMT) has changed manufacturing of modern electronics. It has made designs and assembly methods more efficient. Many modern electronics depend on SMT PCB boards, which make it possible for circuit designs to be small and efficient. This is what today's technology needs. This article discuss about many types of SMT PCB boards, their uses, and the best methods for designing and assembling them. 1. What is an SMT PCB Board? Printed circuit boards called SMT PCB boards, use surfac......