PCB Design Tips: How to Avoid Solder Splatter
PCB Design Tips: How to Avoid Solder Splatter
PCB Design Tips:
Immersion gold should be used to avoid tin blast holes.
HASL is also called hot air leveling (HSAL). Its processing method is to immerse the board vertically down through the guide rail into the liquid high-temperature tin liquid, and then lift it up, and use strong hot air to blow the tin liquid on the surface of the slot hole plate. If the tin hole is too large (round hole or oval hole), the copper surface of the hole wall will sometimes fall off from the base material, which will cause part or all of the copper surface of the hole wall to fall off , causing an open circuit.
Recent Posts
• Light-Emitting Diodes (LEDs)
June 25, 2024
• Understanding the Importance of Annular Rings in PCB Design
June 13, 2024
• 45 Must-Know Flex PCB Design Tips You Can't Afford to Miss!
June 12, 2024
• Precision in Propagation: Navigating Length Matching and Tuning for Single Tracks and Differential Pairs
May 29, 2024
• Shielding in PCB Design: Ensuring Signal Integrity and Electromagnetic Compatibility
May 27, 2024