PCB Design Tips: How to Avoid Solder Splatter
PCB Design Tips: How to Avoid Solder Splatter
PCB Design Tips:
Immersion gold should be used to avoid tin blast holes.
HASL is also called hot air leveling (HSAL). Its processing method is to immerse the board vertically down through the guide rail into the liquid high-temperature tin liquid, and then lift it up, and use strong hot air to blow the tin liquid on the surface of the slot hole plate. If the tin hole is too large (round hole or oval hole), the copper surface of the hole wall will sometimes fall off from the base material, which will cause part or all of the copper surface of the hole wall to fall off , causing an open circuit.
Recent Posts
• Navigating the Impedance Landscape: Selecting the Right Impedance for USB, Ethernet, HDMI, and SD Card Interfaces
July 17, 2024
• The Importance of Using Optocouplers in PCB Design
July 13, 2024
• The Importance of Using ISP Programming Ports in PCB Design
July 13, 2024
• Light-Emitting Diodes (LEDs)
June 25, 2024
• Understanding the Importance of Annular Rings in PCB Design
June 13, 2024