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  • Memory - Serial MCP (Multi Chip Package)

    (50)
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  • Manufacturer
    • FORESEE
    • Infineon Technologies
    • Infineon/Cypress Semicon
    • KIOXIA
    • Microchip Tech
    • Micron Tech
    • MK
    • MXIC(Macronix)
    • RENESAS
    • SK HYNIX
  • PackageType
    • BGA-162
    • BGA-162(8x10.5)
    • FBGA-133(8x8)
    • FBGA-153
    • FBGA-24(6x8)
    • LGA-16(5x6)
    • PDIP-8
    • SOIC-16
    • SOIC-28
    • SOIC-8
  • Block Erase Time(tBE)
    • 3.5ms
    • 3ms
    • 700us
  • Clock Frequency
    • 100MHz
    • 108MHz
    • 400MHz
    • 533MHz
  • Clock Frequency(fc)
    • 100MHz
    • 200MHz
  • Data Retention - TDR (Year)
    • 10 Years
    • 20 Years
  • Flash architecture
    • NAND FLASH
    • NOR FLASH
  • Interface
    • Parallel
    • SPI
  • Memory Size
    • 128Mbit
    • 2Gbit
    • 32GB
    • 4Gbit
    • 64Mbit
  • Memory Size of Flash
    • 256Mbit
    • 64Gbit
  • Memory Size of RAM
    • 64Mbit
  • Operating Temperature
    • -25℃~+85℃
    • -40℃~+105℃
    • -40℃~+80℃
    • -40℃~+85℃
  • Page Program time (TPP)
    • 220us
    • 300us
    • 30us
  • Program / Erase Cycles
    • 100,000 Cycles
  • RAM architecture
    • DRAM
  • Standby Supply Current
    • 0.2uA
    • 12mA
  • Type of memory
    • 1 FLASH +1 RAM
    • 1个FLASH
  • Voltage - Supply
    • 1.7V~1.95V
    • 2.7V~3.6V
    • 3V
    • 4.5V~5.5V
  • Write Cycle Time(tWC)
    • 25ns
    • 45ns
Results remaining: 50
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