XG65T125HS1A
- Manufacturer
- MFR.Part #
- XG65T125HS1A
- JLCPCB Part #
- C2836461
- Package
- DFN-3(8x8)
- Description
- -55℃~+150℃ 1.5pF 1.62V 125mΩ 1470pF 18A 22nC 55pF 650V 67.5W DFN-3(8x8) GaN Transistors(GaN HEMT) ROHS
- EasyEDA Libraries
- Datasheet
- Source
- JLCPCB
- Assembly Type
- SMT Assembly
- PCBA Type
- Economic and Standard
- MSL Level
- MSL 3
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
| Attributes | Value | |
|---|---|---|
| Category | Gallium Nitride (GaN) Devices/GaN Transistors(GaN HEMT) | |
| Manufacturer | XINGUAN | |
| Package | DFN-3(8x8) | |
| Operating Temperature | -55℃~+150℃ | |
| Ciss-Input Capacitance | 1470pF | |
| Gate Threshold Voltage (Vgs(th)) | 1.62V | |
| Gate Charge(Qg) | 22nC | |
| Current - Continuous Drain(Id) | 18A | |
| Reverse Transfer Capacitance (Crss) | 1.5pF | |
| Drain to Source Voltage | 650V | |
| Output Capacitance(Coss) | 55pF | |
| Pd - Power Dissipation | 67.5W | |
| RDS(on) | 125mΩ |
* Images are for reference only
XG65T125HS1A
Extended- Manufacturer
- MFR.Part #
- XG65T125HS1A
- JLCPCB Part #
- C2836461
- Package
- DFN-3(8x8)
- Description
- -55℃~+150℃ 1.5pF 1.62V 125mΩ 1470pF 18A 22nC 55pF 650V 67.5W DFN-3(8x8) GaN Transistors(GaN HEMT) ROHS
- EasyEDA Libraries
- Datasheet
- Source
- JLCPCB
- Assembly Type
- SMT Assembly
- PCBA Type
- Economic and Standard
- MSL Level
- MSL 3
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
* Images are for reference only
XG65T125HS1A
Extended- Manufacturer
- MFR.Part #
- XG65T125HS1A
- JLCPCB Part #
- C2836461
- Package
- DFN-3(8x8)
- Description
- -55℃~+150℃ 1.5pF 1.62V 125mΩ 1470pF 18A 22nC 55pF 650V 67.5W DFN-3(8x8) GaN Transistors(GaN HEMT) ROHS
- EasyEDA Libraries
- Datasheet
- Source
- JLCPCB
- Assembly Type
- SMT Assembly
- PCBA Type
- Economic and Standard
- MSL Level
- MSL 3
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
XG65T125HS1A Specifications
XG65T125HS1A technical specifications, attributes, and parameters.
| Attributes | Value | |
|---|---|---|
| Category | Gallium Nitride (GaN) Devices/GaN Transistors(GaN HEMT) | |
| Manufacturer | XINGUAN | |
| Package | DFN-3(8x8) | |
| Operating Temperature | -55℃~+150℃ | |
| Ciss-Input Capacitance | 1470pF | |
| Gate Threshold Voltage (Vgs(th)) | 1.62V | |
| Gate Charge(Qg) | 22nC | |
| Current - Continuous Drain(Id) | 18A | |
| Reverse Transfer Capacitance (Crss) | 1.5pF | |
| Drain to Source Voltage | 650V | |
| Output Capacitance(Coss) | 55pF | |
| Pd - Power Dissipation | 67.5W | |
| RDS(on) | 125mΩ |
PCB Assembly Tips
From components to fully assembled PCBs. JLCPCB supports PCB assembly for the XG65T125HS1A. Sign up to receive and start your assembly today →
- 1
Step 1 - Pre-order the parts you need from JLCPCB.
- 2
Step 2 - Place a PCBA order to have those parts assembled onto your boards.
- 3
Step 3 - JLCPCB manufactures and assembles your boards in as fast as 3 days.
XG65T125HS1A Documents
XG65T125HS1A datasheets or manufacturer documentation.
Datasheet: XG65T125HS1A Datasheet (PDF)
XG65T125HS1A Schematic Symbol & PCB Footprint
The XG65T125HS1A schematic symbol and PCB footprint are available in the EasyEDA PCB design tool.