SDINBDG4-32G-XI1
- Manufacturer
- MFR.Part #
- SDINBDG4-32G-XI1
- JLCPCB Part #
- C2830399
- Package
- BGA-153(11.5x13)
- Description
- -40℃~+85℃ 150uA 160MB/S 160MB/S 2.7V~3.6V 32GB MLC eMMC 5.1 BGA-153(11.5x13) eMMC ROHS
- EasyEDA Libraries
- ECCN
- EAR99
- Source
- JLCPCB
- Assembly Type
- SMT Assembly
- PCBA Type
- Economic and Standard
- MSL Level
- MSL 3
- X-ray Inspection
- Required
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
| Attributes | Value | |
|---|---|---|
| Category | Memory/eMMC | |
| Manufacturer | SANDISK | |
| Package | BGA-153(11.5x13) | |
| Controller Stand-By Current | 150uA | |
| Operating Temperature | -40℃~+85℃ | |
| Reading Speed in Sequence | 160MB/S | |
| Memory Size | 32GB | |
| configuration | MLC | |
| Writing Speed in Sequence | 160MB/S | |
| NAND Operating Voltage (VCCF) | 2.7V~3.6V | |
| Interface | eMMC 5.1 |
* Images are for reference only
SDINBDG4-32G-XI1
Extended- Manufacturer
- MFR.Part #
- SDINBDG4-32G-XI1
- JLCPCB Part #
- C2830399
- Package
- BGA-153(11.5x13)
- Description
- -40℃~+85℃ 150uA 160MB/S 160MB/S 2.7V~3.6V 32GB MLC eMMC 5.1 BGA-153(11.5x13) eMMC ROHS
- EasyEDA Libraries
- ECCN
- EAR99
- Source
- JLCPCB
- Assembly Type
- SMT Assembly
- PCBA Type
- Economic and Standard
- MSL Level
- MSL 3
- X-ray Inspection
- Required
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
* Images are for reference only
SDINBDG4-32G-XI1
Extended- Manufacturer
- MFR.Part #
- SDINBDG4-32G-XI1
- JLCPCB Part #
- C2830399
- Package
- BGA-153(11.5x13)
- Description
- -40℃~+85℃ 150uA 160MB/S 160MB/S 2.7V~3.6V 32GB MLC eMMC 5.1 BGA-153(11.5x13) eMMC ROHS
- EasyEDA Libraries
- ECCN
- EAR99
- Source
- JLCPCB
- Assembly Type
- SMT Assembly
- PCBA Type
- Economic and Standard
- MSL Level
- MSL 3
- X-ray Inspection
- Required
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
SDINBDG4-32G-XI1 Specifications
SDINBDG4-32G-XI1 technical specifications, attributes, and parameters.
| Attributes | Value | |
|---|---|---|
| Category | Memory/eMMC | |
| Manufacturer | SANDISK | |
| Package | BGA-153(11.5x13) | |
| Controller Stand-By Current | 150uA | |
| Operating Temperature | -40℃~+85℃ | |
| Reading Speed in Sequence | 160MB/S | |
| Memory Size | 32GB | |
| configuration | MLC | |
| Writing Speed in Sequence | 160MB/S | |
| NAND Operating Voltage (VCCF) | 2.7V~3.6V | |
| Interface | eMMC 5.1 |
PCB Assembly Tips
From components to fully assembled PCBs. JLCPCB supports PCB assembly for the SDINBDG4-32G-XI1. Sign up to receive and start your assembly today →
- 1
Step 1 - Pre-order the parts you need from JLCPCB.
- 2
Step 2 - Place a PCBA order to have those parts assembled onto your boards.
- 3
Step 3 - JLCPCB manufactures and assembles your boards in as fast as 3 days.
SDINBDG4-32G-XI1 Schematic Symbol & PCB Footprint
The SDINBDG4-32G-XI1 schematic symbol and PCB footprint are available in the EasyEDA PCB design tool.