SDINBDG4-16G-XI1

Manufacturer

SANDISK

MFR.Part #

SDINBDG4-16G-XI1

JLCPCB Part #

C2830398

Package

BGA-153(11.5x13)

Description

16GB 22K/14K iops 300/120 MB/s eMMC 5.1 BGA-153(11.5x13) eMMC ROHS

CAD Model

PCB Footprint or Symbol

ECCN

3A991B1A

Source

JLCPCB

Assembly Type

SMT Assembly

A PCB assembly fixture is needed to protect and support this part during the assembly process.

MSL Level

Moisture Sensitivity Level (MSL) ratings range from 1 to 6, with MSL 6 being the most sensitive. Normally,components with MSL ratings of 5 or higher require baking to prevent damage from absorbed moisture during reflow soldering. Learn More>

MSL 3

X-ray Inspection

In order to ensure the soldering quality, X-ray inspection is required for components, like BGA, QFN, or other lead-less package types, whose soldering joints are hidden after assembly.

Required