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SDINBDG4-16G-XI1
- Manufacturer
- SANDISK
- MFR.Part #
- SDINBDG4-16G-XI1
- JLCPCB Part #
- C2830398
- Package
- BGA-153(11.5x13)
- Description
- 16GB 22K/14K iops 300/120 MB/s eMMC 5.1 BGA-153(11.5x13) eMMC ROHS
- Datasheet
- Download
- Source
- JLCPCB
- Assembly Type
- SMT Assembly
- CAD Model
- PCB Footprint or Symbol
- ECCN
- 3A991B1A
SDINBDG4-16G-XI1 technical specifications, attributes, and parameters.
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- 1
Step 1 - Pre-order the parts you need at JLCPCB
- 2
Step 2 - To assemble the part you pre-ordered, just place a PCBA order at JLCPCB
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Step 3 - JLCPCB produces and assembles your boards in 3 days.
SDINBDG4-16G-XI1 symbol, PCB footprint from the free EasyEDA PCB design tool.
SDINBDG4-16G-XI1 datasheets or manufacturer documentation.
Datasheet: SDINBDG4-16G-XI1 Datasheet (PDF)
Minimum: 1
Full Reel: 152
Total: $0
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