* Images are for reference only
GD25LE32ESIGR
- Manufacturer
- GigaDevice Semicon Beijing
- MFR.Part #
- GD25LE32ESIGR
- JLCPCB Part #
- C7281238
- Package
- SOIC-8-208mil
- Description
- 32Mbit SPI SOIC-8-208mil NOR FLASH ROHS
- Datasheet
- Download
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- CAD Model
- PCB Footprint or Symbol
- ECCN
- 3A991B1A
GD25LE32ESIGR technical specifications, attributes, and parameters.
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- 1
Step 1 - Pre-order the parts you need at JLCPCB
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![](/ssr/img/assembly-poster.af4832e.png)
GD25LE32ESIGR symbol, PCB footprint from the free EasyEDA PCB design tool.
GD25LE32ESIGR datasheets or manufacturer documentation.
Datasheet: GD25LE32ESIGR Datasheet (PDF)
Minimum: 5
Full Reel: 2000
Total: $0
Available Order Qty: 0
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