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BGA777L7E6327
- Manufacturer
- Infineon Technologies
- MFR.Part #
- BGA777L7E6327
- JLCPCB Part #
- C3191822
- Package
- XFDFN-6-EP
- Description
- 1.2dB 2.3GHz~2.7GHz 17dB UMTS XFDFN-6-EP RF Amplifiers ROHS
- Datasheet
- Download
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- CAD Model
- PCB Footprint or Symbol
- ECCN
- EAR99
BGA777L7E6327 technical specifications, attributes, and parameters.
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- 1
Step 1 - Pre-order the parts you need at JLCPCB
- 2
Step 2 - To assemble the part you pre-ordered, just place a PCBA order at JLCPCB
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Step 3 - JLCPCB produces and assembles your boards in 3 days.
BGA777L7E6327 symbol, PCB footprint from the free EasyEDA PCB design tool.
BGA777L7E6327 datasheets or manufacturer documentation.
Datasheet: BGA777L7E6327 Datasheet (PDF)
Minimum: 9
Full Reel: 7500
Total: $0
Available Order Qty: 0
In-stock Item Pricing