- Manufacturer
- MFR.Part #
- A1101R09C00GR
- JLCPCB Part #
- C6109678
- Package
- BLGA-24
- Description
- -112dBm -40℃~+85℃ 1.8V~3.6V 10dBm 15mA 902MHz、928MHz Integrated temperature sensor、Integrated phase-locked loop、Integrated balun SPI BLGA-24 RF Modules ROHS
- EasyEDA Libraries
- ECCN
- EAR99
- Datasheet
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- PCBA Type
- Standard Only
- MSL Level
- MSL 3
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
| Attributes | Value | |
|---|---|---|
| Category | IoT/Communication Modules/RF Modules | |
| Manufacturer | TTM Technologies, Inc. | |
| Package | BLGA-24 | |
| Operating Temperature | -40℃~+85℃ | |
| Sensitivity | -112dBm | |
| Output Power(Max) | 10dBm | |
| Voltage - Supply | 1.8V~3.6V | |
| Frequency | 902MHz、928MHz | |
| Features | Integrated temperature sensor、Integrated phase-locked loop、Integrated balun | |
| Interface Type | SPI | |
| Receive Current | 15mA |
* Images are for reference only
A1101R09C00GR
Extended- Manufacturer
- MFR.Part #
- A1101R09C00GR
- JLCPCB Part #
- C6109678
- Package
- BLGA-24
- Description
- -112dBm -40℃~+85℃ 1.8V~3.6V 10dBm 15mA 902MHz、928MHz Integrated temperature sensor、Integrated phase-locked loop、Integrated balun SPI BLGA-24 RF Modules ROHS
- EasyEDA Libraries
- ECCN
- EAR99
- Datasheet
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- PCBA Type
- Standard Only
- MSL Level
- MSL 3
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
* Images are for reference only
- Manufacturer
- MFR.Part #
- A1101R09C00GR
- JLCPCB Part #
- C6109678
- Package
- BLGA-24
- Description
- -112dBm -40℃~+85℃ 1.8V~3.6V 10dBm 15mA 902MHz、928MHz Integrated temperature sensor、Integrated phase-locked loop、Integrated balun SPI BLGA-24 RF Modules ROHS
- EasyEDA Libraries
- ECCN
- EAR99
- Datasheet
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- PCBA Type
- Standard Only
- MSL Level
- MSL 3
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
A1101R09C00GR Specifications
A1101R09C00GR technical specifications, attributes, and parameters.
| Attributes | Value | |
|---|---|---|
| Category | IoT/Communication Modules/RF Modules | |
| Manufacturer | TTM Technologies, Inc. | |
| Package | BLGA-24 | |
| Operating Temperature | -40℃~+85℃ | |
| Sensitivity | -112dBm | |
| Output Power(Max) | 10dBm | |
| Voltage - Supply | 1.8V~3.6V | |
| Frequency | 902MHz、928MHz | |
| Features | Integrated temperature sensor、Integrated phase-locked loop、Integrated balun | |
| Interface Type | SPI | |
| Receive Current | 15mA |
PCB Assembly Tips
From components to fully assembled PCBs. JLCPCB supports PCB assembly for the A1101R09C00GR. Sign up to receive and start your assembly today →
- 1
Step 1 - Pre-order the parts you need from JLCPCB.
- 2
Step 2 - Place a PCBA order to have those parts assembled onto your boards.
- 3
Step 3 - JLCPCB manufactures and assembles your boards in as fast as 3 days.
A1101R09C00GR Documents
A1101R09C00GR datasheets or manufacturer documentation.
Datasheet: A1101R09C00GR Datasheet (PDF)
A1101R09C00GR Schematic Symbol & PCB Footprint
The A1101R09C00GR schematic symbol and PCB footprint are available in the EasyEDA PCB design tool.