* Images are for reference only
102010694
Attributes
Value
- Manufacturer
- MFR.Part #
- 102010694
- JLCPCB Part #
- C47997975
- Package
- SMD,21x17.8mm
- Description
- Seeed Studio XIAO ESP32-S3 is a compact, high-performance wireless development board powered by the Espressif ESP32-S3R8 SoC. It features a dual-core 32-bit Xtensa LX7 processor running at up to 240 MHz, together with 8 MB of PSRAM and 8 MB of Flash, providing sufficient processing and memory resources for IoT, wireless control, signal processing, and lightweight edge-AI applications. The board supports 2.4 GHz Wi-Fi, Bluetooth Low Energy 5.0, and Bluetooth Mesh. A U.FL antenna connector and external 2.4 GHz antenna provide reliable wireless connectivity while preserving the compact 21 × 17.8 mm XIAO form factor. XIAO ESP32-S3 provides UART, I²C, SPI, ADC, PWM, capacitive-touch, and native USB interfaces. It also includes USB Type-C connectivity, lithium-battery charging management, Reset and Boot buttons, and user-programmable status indicators. Its castellated pads and single-sided component layout make it suitable for both rapid prototyping and surface-mount integration into custom PCBs.
- EasyEDA Libraries
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- PCBA Type
- Economic and Standard
- MSL Level
- MSL 1
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
| Attributes | Value | |
|---|---|---|
| Category | IoT/Communication Modules/Bluetooth Modules | |
| Manufacturer | Seeed | |
| Package | SMD,21x17.8mm |
Results remaining: 0
* Images are for reference only
102010694
Extended- Manufacturer
- MFR.Part #
- 102010694
- JLCPCB Part #
- C47997975
- Package
- SMD,21x17.8mm
- Description
- Seeed Studio XIAO ESP32-S3 is a compact, high-performance wireless development board powered by the Espressif ESP32-S3R8 SoC. It features a dual-core 32-bit Xtensa LX7 processor running at up to 240 MHz, together with 8 MB of PSRAM and 8 MB of Flash, providing sufficient processing and memory resources for IoT, wireless control, signal processing, and lightweight edge-AI applications. The board supports 2.4 GHz Wi-Fi, Bluetooth Low Energy 5.0, and Bluetooth Mesh. A U.FL antenna connector and external 2.4 GHz antenna provide reliable wireless connectivity while preserving the compact 21 × 17.8 mm XIAO form factor. XIAO ESP32-S3 provides UART, I²C, SPI, ADC, PWM, capacitive-touch, and native USB interfaces. It also includes USB Type-C connectivity, lithium-battery charging management, Reset and Boot buttons, and user-programmable status indicators. Its castellated pads and single-sided component layout make it suitable for both rapid prototyping and surface-mount integration into custom PCBs.
- EasyEDA Libraries
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- PCBA Type
- Economic and Standard
- MSL Level
- MSL 1
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
* Images are for reference only
102010694
Extended- Manufacturer
- MFR.Part #
- 102010694
- JLCPCB Part #
- C47997975
- Package
- SMD,21x17.8mm
- Description
- Seeed Studio XIAO ESP32-S3 is a compact, high-performance wireless development board powered by the Espressif ESP32-S3R8 SoC. It features a dual-core 32-bit Xtensa LX7 processor running at up to 240 MHz, together with 8 MB of PSRAM and 8 MB of Flash, providing sufficient processing and memory resources for IoT, wireless control, signal processing, and lightweight edge-AI applications. The board supports 2.4 GHz Wi-Fi, Bluetooth Low Energy 5.0, and Bluetooth Mesh. A U.FL antenna connector and external 2.4 GHz antenna provide reliable wireless connectivity while preserving the compact 21 × 17.8 mm XIAO form factor. XIAO ESP32-S3 provides UART, I²C, SPI, ADC, PWM, capacitive-touch, and native USB interfaces. It also includes USB Type-C connectivity, lithium-battery charging management, Reset and Boot buttons, and user-programmable status indicators. Its castellated pads and single-sided component layout make it suitable for both rapid prototyping and surface-mount integration into custom PCBs.
- EasyEDA Libraries
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- PCBA Type
- Economic and Standard
- MSL Level
- MSL 1
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
102010694 Specifications
102010694 technical specifications, attributes, and parameters.
| Attributes | Value | |
|---|---|---|
| Category | IoT/Communication Modules/Bluetooth Modules | |
| Manufacturer | Seeed | |
| Package | SMD,21x17.8mm |
Results remaining: 0
PCB Assembly Tips
From components to fully assembled PCBs. JLCPCB supports PCB assembly for the 102010694. Sign up to receive and start your assembly today →
- 1
Step 1 - Pre-order the parts you need from JLCPCB.
- 2
Step 2 - Place a PCBA order to have those parts assembled onto your boards.
- 3
Step 3 - JLCPCB manufactures and assembles your boards in as fast as 3 days.
102010694 Schematic Symbol & PCB Footprint
The 102010694 schematic symbol and PCB footprint are available in the EasyEDA PCB design tool.