SDINBDG4-64G-XI1

Manufacturer

SANDISK

MFR.Part #

SDINBDG4-64G-XI1

JLCPCB Part #

C3446132

Package

BGA-153

Description

BGA-153 eMMC ROHS

Datasheet

Download

Source

JLCPCB

Assembly Type

SMT Assembly

A PCB assembly fixture is needed to protect and support this part during the assembly process.

CAD Model

PCB Footprint or Symbol

ECCN

EAR99

MSL Level

Moisture Sensitivity Level (MSL) ratings range from 1 to 6, with MSL 6 being the most sensitive. Normally,components with MSL ratings of 5 or higher require baking to prevent damage from absorbed moisture during reflow soldering. Learn More>

MSL 3