BGB717L7ESDE6327
- Manufacturer
- MFR.Part #
- BGB717L7ESDE6327
- JLCPCB Part #
- C3191815
- Package
- XFDFN-6-EP
- Description
- 1.8V~4V 12dB 1dB 3mA 76MHz~108MHz XFDFN-6-EP RF Amplifiers ROHS
- EasyEDA Libraries
- ECCN
- EAR99
- Datasheet
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- PCBA Type
- Economic and Standard
- MSL Level
- MSL 3
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
| Attributes | Value | |
|---|---|---|
| Category | RF and Wireless/RF Amplifiers | |
| Manufacturer | Infineon Technologies | |
| Package | XFDFN-6-EP | |
| Frequency Range | 76MHz~108MHz | |
| Input return loss | 0.5dB | |
| Voltage - Supply | 1.8V~4V | |
| Output return loss | 16dB | |
| P1dB | -5.5dBm | |
| Features | Low-power mode、Bias control circuit、Electrostatic protection | |
| Noise Figure | 1dB | |
| Current - Supply | 3mA | |
| IP3 | -12.5dBm | |
| Gain | 12dB |
* Images are for reference only
BGB717L7ESDE6327
Extended- Manufacturer
- MFR.Part #
- BGB717L7ESDE6327
- JLCPCB Part #
- C3191815
- Package
- XFDFN-6-EP
- Description
- 1.8V~4V 12dB 1dB 3mA 76MHz~108MHz XFDFN-6-EP RF Amplifiers ROHS
- EasyEDA Libraries
- ECCN
- EAR99
- Datasheet
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- PCBA Type
- Economic and Standard
- MSL Level
- MSL 3
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
* Images are for reference only
BGB717L7ESDE6327
Extended- Manufacturer
- MFR.Part #
- BGB717L7ESDE6327
- JLCPCB Part #
- C3191815
- Package
- XFDFN-6-EP
- Description
- 1.8V~4V 12dB 1dB 3mA 76MHz~108MHz XFDFN-6-EP RF Amplifiers ROHS
- EasyEDA Libraries
- ECCN
- EAR99
- Datasheet
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- PCBA Type
- Economic and Standard
- MSL Level
- MSL 3
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.
BGB717L7ESDE6327 Specifications
BGB717L7ESDE6327 technical specifications, attributes, and parameters.
| Attributes | Value | |
|---|---|---|
| Category | RF and Wireless/RF Amplifiers | |
| Manufacturer | Infineon Technologies | |
| Package | XFDFN-6-EP | |
| Frequency Range | 76MHz~108MHz | |
| Input return loss | 0.5dB | |
| Voltage - Supply | 1.8V~4V | |
| Output return loss | 16dB | |
| P1dB | -5.5dBm | |
| Features | Low-power mode、Bias control circuit、Electrostatic protection | |
| Noise Figure | 1dB | |
| Current - Supply | 3mA | |
| IP3 | -12.5dBm | |
| Gain | 12dB |
PCB Assembly Tips
From components to fully assembled PCBs. JLCPCB supports PCB assembly for the BGB717L7ESDE6327. Sign up to receive and start your assembly today →
- 1
Step 1 - Pre-order the parts you need from JLCPCB.
- 2
Step 2 - Place a PCBA order to have those parts assembled onto your boards.
- 3
Step 3 - JLCPCB manufactures and assembles your boards in as fast as 3 days.
BGB717L7ESDE6327 Documents
BGB717L7ESDE6327 datasheets or manufacturer documentation.
Datasheet: BGB717L7ESDE6327 Datasheet (PDF)
BGB717L7ESDE6327 Schematic Symbol & PCB Footprint
The BGB717L7ESDE6327 schematic symbol and PCB footprint are available in the EasyEDA PCB design tool.