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WAFER-HY2.0-11PJK
- Manufacturer
- XUNPU
- MFR.Part #
- WAFER-HY2.0-11PJK
- JLCPCB Part #
- C22370376
- Package
- P=2mm
- Description
- 2mm P=2mm Housings (Wire To Board / Wire To Wire ) ROHS
- Datasheet
- Download
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- CAD Model
- PCB Footprint or Symbol
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- 1
Step 1 - Pre-order the parts you need at JLCPCB
- 2
Step 2 - To assemble the part you pre-ordered, just place a PCBA order at JLCPCB
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Step 3 - JLCPCB produces and assembles your boards in 3 days.
WAFER-HY2.0-11PJK technical specifications, attributes, and parameters.
WAFER-HY2.0-11PJK symbol, PCB footprint from the free EasyEDA PCB design tool.
WAFER-HY2.0-11PJK datasheets or manufacturer documentation.
Datasheet: WAFER-HY2.0-11PJK Datasheet (PDF)
Minimum: 233
Full Reel: 1000
Total: $0
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