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SA5532N

Manufacturer
HGSEMI
MFR.Part #
SA5532N
JLCPCB Part #
C20613252
Package
DIP-8
Description
DIP-8 Operational Amplifier ROHS
Datasheet
Download
Source
JLCPCB
Assembly Type
Wave Soldering
CAD Model
PCB Footprint or Symbol
ECCN
-
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SA5532N technical specifications, attributes, and parameters.

No Data

SA5532N symbol, PCB footprint from the free EasyEDA PCB design tool.

SA5532N datasheets or manufacturer documentation.

Datasheet: SA5532N Datasheet (PDF)

In Stock: 0

Minimum: 50

Full Reel: 50

Total: $0

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