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BGM13HBA9E6327XTSA1
- Manufacturer
- Infineon Technologies
- MFR.Part #
- BGM13HBA9E6327XTSA1
- JLCPCB Part #
- C7219883
- Package
- -
- Description
- - Bluetooth Modules ROHS
- Datasheet
- Download
- Source
- JLCPCB
- Assembly Type
- Wave Soldering
- CAD Model
- PCB Footprint or Symbol
- ECCN
- EAR99
BGM13HBA9E6327XTSA1 technical specifications, attributes, and parameters.
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- 1
Step 1 - Pre-order the parts you need at JLCPCB
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Step 2 - To assemble the part you pre-ordered, just place a PCBA order at JLCPCB
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Step 3 - JLCPCB produces and assembles your boards in 3 days.
![](/ssr/img/assembly-poster.af4832e.png)
BGM13HBA9E6327XTSA1 symbol, PCB footprint from the free EasyEDA PCB design tool.
BGM13HBA9E6327XTSA1 datasheets or manufacturer documentation.
Datasheet: BGM13HBA9E6327XTSA1 Datasheet (PDF)
Minimum: 11
Full Reel: 4500
Total: $0
Available Order Qty: 0
In-stock Item Pricing