BGT60TR13CE6327XUMA1

Manufacturer

Infineon Technologies

MFR.Part #

BGT60TR13CE6327XUMA1

JLCPCB Part #

C3606641

Package

BGA-119

Description

100Mbps Mobile Phone 57GHz~64GHz SPI BGA-119 RF Transceiver ICs ROHS

Datasheet

Download

CAD Model

PCB Footprint or Symbol

ECCN

EAR99

Source

JLCPCB

Assembly Type

SMT Assembly

A PCB assembly fixture is needed to protect and support this part during the assembly process.

X-ray Inspection

In order to ensure the soldering quality, X-ray inspection is required for components, like BGA, QFN, or other lead-less package types, whose soldering joints are hidden after assembly.

Required