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CIGW252010GL2R2MNE

Manufacturer: SAMSUNG ELECTRO-MECHANICS

MFR.Part #: CIGW252010GL2R2MNE

JLCPCB Part #: C16195798

Package: 1008

Description: 2.2 µH Shielded Drum Core, Wirewound Inductor 2.2 A 93mOhm Max 1008 (2520 Metric)

Datasheet: Download

Source: JLCPCB

Assembly Type: SMT Assembly

CAD Model: PCB Footprint or Symbol

ECCN: EAR99

Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.

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CIGW252010GL2R2MNE technical specifications, attributes, and parameters.

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CIGW252010GL2R2MNE symbol, PCB footprint from the free EasyEDA PCB design tool.

CIGW252010GL2R2MNE datasheets or manufacturer documentation.

Datasheet: CIGW252010GL2R2MNE Datasheet (PDF)

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