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CIGW252010GL2R2MNE
- Manufacturer
- SAMSUNG ELECTRO-MECHANICS
- MFR.Part #
- CIGW252010GL2R2MNE
- JLCPCB Part #
- C16195798
- Package
- 1008
- Description
- 2.2 µH Shielded Drum Core, Wirewound Inductor 2.2 A 93mOhm Max 1008 (2520 Metric)
- Datasheet
- Download
- Source
- JLCPCB
- Assembly Type
- SMT Assembly
- CAD Model
- PCB Footprint or Symbol
- ECCN
- EAR99
CIGW252010GL2R2MNE technical specifications, attributes, and parameters.
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- 1
Step 1 - Pre-order the parts you need at JLCPCB
- 2
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![](/ssr/img/assembly-poster.af4832e.png)
CIGW252010GL2R2MNE symbol, PCB footprint from the free EasyEDA PCB design tool.
CIGW252010GL2R2MNE datasheets or manufacturer documentation.
Datasheet: CIGW252010GL2R2MNE Datasheet (PDF)
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