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CIGW252010GL2R2MNE

Manufacturer
SAMSUNG ELECTRO-MECHANICS
MFR.Part #
CIGW252010GL2R2MNE
JLCPCB Part #
C16195798
Package
1008
Description
2.2 µH Shielded Drum Core, Wirewound Inductor 2.2 A 93mOhm Max 1008 (2520 Metric)
Datasheet
Download
Source
JLCPCB
Assembly Type
SMT Assembly
CAD Model
PCB Footprint or Symbol
ECCN
EAR99
Note: The purchased components are stored in your JLCPCB parts library for future PCBA orders only, and cannot be shipped separately.

CIGW252010GL2R2MNE technical specifications, attributes, and parameters.

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CIGW252010GL2R2MNE symbol, PCB footprint from the free EasyEDA PCB design tool.

CIGW252010GL2R2MNE datasheets or manufacturer documentation.

Datasheet: CIGW252010GL2R2MNE Datasheet (PDF)

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