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The Critical Role of PCB Trace Width and How to Calculate It

Navigating the complex landscape of printed circuit board (PCB) design demands a deep understanding of numerous critical factors, with trace width taking center stage. This vital aspect of PCB design holds the key to unlocking superior electronic device performance, ensuring reliability, and optimizing functionality. In this comprehensive guide, we delve into the world of PCB trace widths, exploring their profound influence on signal integrity, thermal management, and electrical prowess. Armed with kn......

Mar 6, 2024

PCB Design All posts >

Shielding in PCB Design: Ensuring Signal Integrity and Electromagnetic Compatibility

Printed Circuit Board (PCB) design plays a pivotal role in determining the performance and reliability of electronic devices. As technology advances, the demand for high-speed data transmission and increased electronic complexity grows. To meet these challenges, engineers are turning to effective shielding techniques in PCB design. In this blog post, we'll delve into the importance of shielding, its benefits, types of shielding, and best practices for implementation. The Significance of Shielding In t......

Enhancing PCB Reliability: A Deep Dive into VIA-in-PAD Design

Printed Circuit Board (PCB) design is a critical aspect of electronic product development, and engineers continually seek innovative solutions to improve performance, reliability, and miniaturization. One such design technique gaining prominence is VIA-in-PAD (VIP) implementation. In this blog post, we'll explore the significance, advantages, challenges, and best practices associated with VIA-in-PAD in PCB design. What is VIA-in-PAD? VIA-in-PAD refers to the practice of placing vias directly within th......

Achieving Harmony in Mixed-Signal PCB Design

In the electronic world, it's now common to mix analog and digital parts on one board due to changes. Mixed-signal PCB design represents a harmonious marriage of analog and digital worlds, unlocking a myriad of possibilities for sophisticated electronic devices. This blog post will talk about mixed-signal PCB design. It will cover the challenges, best practices, and important factors for achieving optimal performance. The Essence of Mixed-Signal Design Mixed-signal design refers to the integration of ......

Innovating PCB Design: Leveraging DFM Principles for Enhanced Functionality and Manufacturing Efficiency

In the realm of electronics manufacturing, the initial design phase stands as a pivotal determinant of project success. For PCB (Printed Circuit Board) designers, integrating Design for Manufacturing (DFM) principles into their workflow is paramount. These principles ensure efficient, cost-effective manufacturing with uncompromising quality. Essential guidelines, from component selection to testing, guide designers to optimize their designs for manufacturing efficiency and excellence. I. Component Sel......

PCB Manufacturing All posts >

DFM's Key Role in PCB Manufacturing

DFM design in PCB stands for Design for Manufacturability in Printed Circuit Board. In today's highly digital and electronic era, printed circuit boards (PCBs) serve as a backbone and crucial foundation for connecting and supporting electronic components. The quality and efficiency of PCB manufacturing are essential. The impact of design on manufacturing lies in DFM (Design for Manufacturing) – that is, designing for manufacturing. Design for Manufacturing (DFM) plays a crucial role in PCB manufacturi......

How to Avoid Copper Peel Off

Hot Air Solder Leveling (HASL) involves coating the surface of the exposed copper with a layer of tin alloy to prevent oxidation and provide a good soldering surface for subsequent assembly. The basic process of HASL is to briefly immerse the PCB board into a high-temperature liquid tin bath. Through the action of flux and high-temperature tin, a copper-tin alloy (IMG) is formed. Then, on guide rails, the board is lifted out while high-pressure gas blows away excess tin from non-copper areas and level......

Technical Guidance: Mouse Bite Panelization Guide

The conventional method of panelization uses V-grooves. However, for irregularly-shaped boards or special requirements (such as JLCPCB's economic SMT assembly), mouse bite panelization, which resembles postage stamps on an envelope, is required. PCBs panelized using this method are called "mouse bite panels" or "mouse bite connections". Mouse bite panelization can be referred to as "universal panelization." As long as there is a position to add mouse bites, boards of various shapes can be interconnect......

How to Choose the Right Surface Finish for Your PCB

When it comes to designing and manufacturing of printed circuit boards (PCBs), considering the element of your surface finish is a critical decision. In addition to influencing the PCB's aesthetics, surface finish is essential to the functionality, dependability, solderability and longevity of the electronic equipment it powers. The surface finish serves as a protective layer on the exposed copper traces of a PCB. It prevents oxidation, promotes solderability, enhances conductivity, and provides a lev......

PCB Knowledge All posts >

Why PCB Stencil Are Key to High-Quality SMT Assembly

PCB(Printed Circuit Board) stencil is a critical component of Surface Mount Technology (SMT) assembly. It plays a vital role in ensuring the accuracy and consistency of SMT assembly results, which directly affects the functionality and performance of the final product. PCB stencil also called SMT stencil, Circuit Board stencil is used to apply solder paste to the PCB, which is then used to attach SMT components to the board. Without the use of PCB stencil, it becomes challenging to achieve high-qualit......

What is PCB Via and Which Type Should You Choose?

Printed Circuit Board (PCB) design is a critical aspect of electronic product development. PCBs provide an organized and compact layout for electronic components, enabling efficient signal transmission and minimizing the risk of electrical interference. One essential element of PCB design is the via, a small hole drilled into the board that allows electrical connections between the different layers of the board. In this article, we will provide a comprehensive overview of PCB via, including its types,......

PCB Teardrop You Should Know

In the design and manufacturing of PCBs (Printed Circuit Boards), the teardrop (Pad Tear Drop) plays a vital role. It is not only the connection point between electronic components and PCB, but it can also enhance the soldering strength and improve stability. This article will delve into what a PCB teardrop is, what it does, and how to set up a PCB teardrop to help you better understand and apply this key technology. What is a PCB Teardrop? PCB teardrops are small drops of solder material that form ar......

Understanding PCB Tombstone: Causes and Solutions

In the ever-evolving landscape of PCB (Printed Circuit Board) and PCBA (Printed Circuit Board Assembly), manufacturers face an array of challenges, from intricate designs to precise assembly processes. Among these challenges, PCB tombstoning stands out as a particularly vexing issue. Tombstoning occurs during the reflow soldering process when one end of a surface-mounted component lifts off the pad, resembling a tombstone. This seemingly minor defect can have major repercussions, jeopardizing the func......

PCB Assembly All posts >

Exploring the Differences Between Reflow Soldering and Wave Soldering in PCB Assembly

In PCB assembly processing, wave soldering and reflow soldering are two common soldering processes, but the choice of soldering method varies depending on the scenario. What is the difference between these two welding processes? Principles and Applications of Wave Soldering Wave soldering is a batch PCB soldering process mainly used for soldering through-hole devices (THD). The wave soldering process consists of four steps: flux spraying, pre-coating, wave soldering, and cooling. 1.Flux is primarily u......

A Comprehensive Guide to IC Package Technology

What is IC package? IC packaging is the process of packaging electronic components (such as chips, transistors, capacitors, resistors, etc.) into specific shapes and sizes so that they can be easily mounted on a PCB and connected to a circuit. Encapsulation not only provides mechanical protection but also offers electrical connections and thermal management functions. IC package type and size IC package types and sizes vary depending on the component type, function, and application. The following are ......

How to Solve Common Wave Soldering Defects

Wave Soldering Defects The wave soldering process is the primary process that causes defects in PCBA components. It causes a defect rate of up to 50% in the entire PCBA assembly process. Wave soldering is best suited for through-hole components (components with leads inserted into drilled holes in the circuit board). The following are some common problems and their solutions during the wave soldering process: Incomplete Solder Incomplete soldering occurs when the solder fails to adhere properly to the......

Technical Guidance: BGA Design Rules

With the advancement of the electronics industry, chip integration continues to increase, the number of IO pins quickly rises, and power consumption grows accordingly, leading to stricter requirements for integrated circuit packaging. To meet the demands of this progress, Ball Grid Array (BGA) packaging technology is introduced. This technology involves the creation of an array of solder balls on the bottom of the package substrate as the I/O interface for the circuit, connecting it to the printed cir......